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Ultrasonic Applications: Ultrasonic Joining Process
Ultrasonic Applications: Ultrasonic Joining Process
The Adwells ultrasonic bonding process allows for the joining of dissimilar and similar metals at room temperature. The bonding time is less than one second in most application cases, making it a highly productive processing method.
1～12 item / All 12 items
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Ultrasonic Pin Joining Device PB2000MS
In the data settings, the pin connection position can be freely changed! It is possible to create heat sinks with a high degree of freedom.
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Flexible substrate ultrasonic bonding application
There are advantages of ultrasonic bonding such as low resistance, short time, and room temperature joining!
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Standalone Ultrasonic Metal Welding Machine UB050/300/500SA
Compact and easy to deploy in production and development sites! Equipped with comprehensive process monitoring features.
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Standalone Ultrasonic Welding Machine UB2000/3000/5000SA
In addition to joining the same type of metal, welding enables the joining of different types of metals that is difficult to achieve!
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Ultrasonic Metal Joining Device UB2000/3000/5000LS
Ideal for power devices! The ultrasonic head is highly rigid and compact!
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Ultrasonic Seam Welding Machine SB200/400CE
Ultrasonic seam welding machine that transforms manufacturing with rotary ultrasonic welding.
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Flip Chip Bonder "FB2000SS"
Supports various processes with head exchange! Achieves a wide dynamic range through a low-friction pressurization mechanism.
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Ultrasonic Metal Joining Device UP-Lite1500
Compatible with a wide range of applications! A multifunctional ultrasonic welding system integrated in a compact design.
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Ultrasonic Ribbon Bond RB0300SS
Power module and secondary battery circuit formation! Digital control of position, load, and ultrasound.
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DMB bonding application using ultrasonic bonding
Welding is possible under low joining conditions! It is possible to join materials with a large area and thickness.
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Direct bonding of substrates using ultrasonic waves.
Introducing an application that uses ultrasonic bonding to connect flexible substrates with low resistance!
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Ultrasonic Process Optimization System 'UMOS'
For those struggling with setting joining and cutting conditions tailored to various materials!
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