Standalone Ultrasonic Welding Machine UB2000/3000/5000SA
![[Device Category] Ultrasonic Welding Device](https://image.mono.ipros.com/public/premium/image_category/a8a/1430943/IPROS64786709892895228434.png?w=140&h=140){kind=small}
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![[Device Category] Ultrasonic Welding Device](https://image.mono.ipros.com/public/premium/image_category/a8a/1430943/IPROS18280580037540925390.png?w=140&h=140){kind=small}
In addition to joining the same type of metal, welding enables the joining of different types of metals that is difficult to achieve!
The "UB2000/3000/5000SA" is an ultrasonic welding machine suitable for secondary batteries and power-related devices. Equipped with comprehensive process monitoring functions, it allows for detailed understanding of process operations through various sensor information built into the device, making it effective for process startup and mass production management. Additionally, the built-in linear encoder and rigid clamp in the welding head accurately control the position of the weld joint with a high-rigidity ultrasonic horn unit. 【Features】 ■ High-rigidity horn clamp mechanism ■ High-precision position control ■ High-performance load control ■ Comprehensive process monitoring functions *For more details, please refer to the PDF materials or feel free to contact us.
basic information
【Specifications】 ■Head Load: Load 50–1800N ■Head Type: Ultrasonic Head ■Ultrasonic Frequency: Frequency 20kHz (3000/1250W), 30kHz (1250W) ■Head Control: Digital control of load and ultrasound ■Joining Monitoring: Standard profile reference software included ■Recipe: Digital setting of joining conditions ■Utilities ・Air Source: 0.5MPa Dry Air ・Power Supply: Main unit 200V10A, Oscillator 20kHz: 200V20A/8A, 30kHz: 200V8A ■Unit Size: W310 x D400 x H1908mm (Main unit) ■Unit Weight: 200kg *For more details, please refer to the PDF document or feel free to contact us.
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Delivery Time
Applications/Examples of results
【Applications】 ■ Joining of similar and dissimilar metals ■ Bulk joining of metal foils ■ Joining of magnet wires *For more details, please refer to the PDF document or feel free to contact us.
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News about this product（3）
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Notice of Participation in "JPCA Show 2025" from June 4 (Wednesday) to June 6 (Friday), 2025.
Adwells Co., Ltd. will be exhibiting at the "JPCA Show 2025 (Total Solution Exhibition for Electronic Devices)" held at Tokyo Big Sight. At the exhibition, we will introduce ultrasonic application technologies such as heat sink formation, power module bonding, DMB bonding, flexible substrate bonding, and ultrasonic cutting. Additionally, we plan to display a variety of samples processed with our equipment from various fields, which we believe will be helpful in realizing new ideas and solving challenges. We invite you to visit our booth when you attend the event.
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"May 14 (Wednesday) to May 16 (Friday), 2025" Announcement of participation in the "9th Adhesive and Joining EXPO (Osaka)" (Hall 4, Booth No. 18-78)
Adwells Co., Ltd. will be exhibiting at the "9th Adhesive and Joining EXPO (Osaka)" held at Intex Osaka (Hall 4, Booth No. 18-78). Our company is a manufacturer of ultrasonic application devices with unique ultrasonic technology. We will propose devices that apply ultrasonic technology for joining, cutting, and welding, and we plan to introduce joining/welding technology and cutting technology as ultrasonic application technologies at the exhibition. Additionally, we will showcase a variety of samples processed with our devices from various fields, which we believe will be helpful in realizing new ideas and solving challenges. Exhibits: - Heat sink formation using pins/ribbons/block fins - Power module joining (terminal joining, terminal joining without patterns or with minimal patterns, inter-board joining) - DMB joining (harness joining on organic substrates, discrete devices, large area joining) - Flexible substrate joining (short-time joining, room temperature joining, low connection joining) - Ultrasonic cutting (cutting of soft multilayer materials, cutting of green sheets, slicing of TIM, cutting of active material coated electrodes) We sincerely look forward to your visit.
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We will be exhibiting at the 18th Battery Japan [Spring] International Secondary Battery Exhibition at Tokyo Big Sight - showcasing dry environment-compatible samples, all-solid-state battery samples, electrode shape cut/separator welding samples, DMB bonding samples, and multilayer foil bonding samples.
We will be exhibiting at the 18th Battery Japan [Spring] International Secondary Battery Expo, which will be held at Tokyo Big Sight starting from February 19, 2025 (Wednesday). On that day, we will introduce ultrasonic application technologies, including dry environment compatibility, all-solid-state batteries, electrode shape cutting/separator welding, DMB bonding, and multilayer foil bonding. We will also display a variety of samples processed with our equipment from various fields, which we believe will help in realizing new ideas and solving challenges. We invite you to visit our booth when you attend.
