Flip Chip Bonder "FB2000SS"
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![[Device Category] Ultrasonic Welding Device](https://image.mono.ipros.com/public/premium/image_category/a8a/1430943/IPROS18280580037540925390.png?w=140&h=140){kind=small}
Supports various processes with head exchange! Achieves a wide dynamic range through a low-friction pressurization mechanism.
The "FB2000SS" is a flip chip bonder suitable for high-precision semiconductor mounting. The ultrasonic horn is directly clamped by a rigid clamp. High rigidity clamping ensures high flatness even under high loads. Additionally, it features an alignment calibration function that corrects for temporal changes, along with dual-field recognition, achieving stable high-precision mounting. 【Features】 ■ High-rigidity horn clamp mechanism ■ High-precision alignment ■ High-function position load control ■ Compatible with various processes through head exchange *For more details, please download the PDF or feel free to contact us.
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News about this product（2）
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Notice of Participation in "JPCA Show 2025" from June 4 (Wednesday) to June 6 (Friday), 2025.
Adwells Co., Ltd. will be exhibiting at the "JPCA Show 2025 (Total Solution Exhibition for Electronic Devices)" held at Tokyo Big Sight. At the exhibition, we will introduce ultrasonic application technologies such as heat sink formation, power module bonding, DMB bonding, flexible substrate bonding, and ultrasonic cutting. Additionally, we plan to display a variety of samples processed with our equipment from various fields, which we believe will be helpful in realizing new ideas and solving challenges. We invite you to visit our booth when you attend the event.
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"May 14 (Wednesday) to May 16 (Friday), 2025" Announcement of participation in the "9th Adhesive and Joining EXPO (Osaka)" (Hall 4, Booth No. 18-78)
Adwells Co., Ltd. will be exhibiting at the "9th Adhesive and Joining EXPO (Osaka)" held at Intex Osaka (Hall 4, Booth No. 18-78). Our company is a manufacturer of ultrasonic application devices with unique ultrasonic technology. We will propose devices that apply ultrasonic technology for joining, cutting, and welding, and we plan to introduce joining/welding technology and cutting technology as ultrasonic application technologies at the exhibition. Additionally, we will showcase a variety of samples processed with our devices from various fields, which we believe will be helpful in realizing new ideas and solving challenges. Exhibits: - Heat sink formation using pins/ribbons/block fins - Power module joining (terminal joining, terminal joining without patterns or with minimal patterns, inter-board joining) - DMB joining (harness joining on organic substrates, discrete devices, large area joining) - Flexible substrate joining (short-time joining, room temperature joining, low connection joining) - Ultrasonic cutting (cutting of soft multilayer materials, cutting of green sheets, slicing of TIM, cutting of active material coated electrodes) We sincerely look forward to your visit.
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In addition to our unique technologies such as ultrasonic application technology, we contribute to our customers' technological innovations as a device manufacturer in the following business areas, including research and development and mass production processes, by flexibly responding to customer needs. Our devices are designed with the premise of freely controlling processes using cutting-edge device technology and process technology, serving as tools to realize ideas and assist in our customers' product innovations. ■ Core Technologies - Ultrasonic application technology (expanding applications in the fields of bonding, cutting, and welding) - Actuator technology (achieving simultaneous control of position and load with our unique air pressurization technology) - Device technology (providing functions that satisfy customer needs in the form of devices) ■ Business Areas Developing, manufacturing, and selling product manufacturing equipment in the following fields: - Secondary battery field - Electronics field - Automotive field - High-performance materials field - Carbon fiber reinforced resin field