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Ultrasonic Ribbon Bond RB0300SS

Power module and secondary battery circuit formation! Digital control of position, load, and ultrasound.

The "RB0300SS" is an ultrasonic ribbon bonder that forms heat dissipation fins in a programmable manner through ribbon bonding. It supports the bonding and cutting of ribbons for inter-terminal bonding, such as in power modules and DBC electrode bonding. By performing Cu ribbon bonding after joining with an Al binder, it enables circuit formation on fragile materials such as chip surfaces (ABB process). 【Features】 ■ Inter-terminal bonding for power module DBC electrodes ■ Formation of fins for power modules ■ Bonding to fragile materials ■ Inter-terminal bonding for secondary battery terminals *For more details, please download the PDF or feel free to contact us.

Related Link - https://www.adwelds.com/

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【Application】 ■IGBT Module ■Secondary Battery *For more details, please download the PDF or feel free to contact us.

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For more details, please download the PDF or feel free to contact us.

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In addition to our unique technologies such as ultrasonic application technology, we contribute to our customers' technological innovations as a device manufacturer in the following business areas, including research and development and mass production processes, by flexibly responding to customer needs. Our devices are designed with the premise of freely controlling processes using cutting-edge device technology and process technology, serving as tools to realize ideas and assist in our customers' product innovations. ■ Core Technologies - Ultrasonic application technology (expanding applications in the fields of bonding, cutting, and welding) - Actuator technology (achieving simultaneous control of position and load with our unique air pressurization technology) - Device technology (providing functions that satisfy customer needs in the form of devices) ■ Business Areas Developing, manufacturing, and selling product manufacturing equipment in the following fields: - Secondary battery field - Electronics field - Automotive field - High-performance materials field - Carbon fiber reinforced resin field