Mass production ultrasonic metal joining device TB1000MS
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This is a mass production ultrasonic metal joining device suitable for inverter production!
The "TB1000MS" is a mass production ultrasonic metal joining device suitable for inverter production. ■ It is suitable for electrode connections in high-temperature inverters and other applications. 【Features】 - Flexible production ⇒ Covers joining conditions suitable for various terminals with a single device - Strong against terminal float ⇒ Starts joining by pressing down on the float with an air servo - Color image processing ⇒ Stable alignment of terminals and horns through color image recognition *For more details, please download the PDF or feel free to contact us.
basic information
【Specifications】 ■Bonding force: Load 10–1000N ■Head height control: Repeated positioning accuracy ±25μm ■Head availability: Ultrasonic head ■Ultrasonic head: Frequency: 20kHz (can be easily switched to 30kHz or 40kHz) ■Ultrasonic output: 1200W ■Head control: Digital control of position, load, and ultrasound ■Bonding monitor: Standard profile reference software included ■Parallel adjustment: Three-point adjustment method ■Utility: Pneumatic source 0.5Mpa dry air, power supply three-phase 200V 25A ■Unit size: W1154×D1402×H1759mm ■Unit weight: 600kg *For more details, please download the PDF or feel free to contact us.
Price information
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Delivery Time
Applications/Examples of results
For more details, please download the PDF or feel free to contact us.
catalog（1）
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News about this product（2）
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Notice of Participation in "JPCA Show 2025" from June 4 (Wednesday) to June 6 (Friday), 2025.
Adwells Co., Ltd. will be exhibiting at the "JPCA Show 2025 (Total Solution Exhibition for Electronic Devices)" held at Tokyo Big Sight. At the exhibition, we will introduce ultrasonic application technologies such as heat sink formation, power module bonding, DMB bonding, flexible substrate bonding, and ultrasonic cutting. Additionally, we plan to display a variety of samples processed with our equipment from various fields, which we believe will be helpful in realizing new ideas and solving challenges. We invite you to visit our booth when you attend the event.
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"May 14 (Wednesday) to May 16 (Friday), 2025" Announcement of participation in the "9th Adhesive and Joining EXPO (Osaka)" (Hall 4, Booth No. 18-78)
Adwells Co., Ltd. will be exhibiting at the "9th Adhesive and Joining EXPO (Osaka)" held at Intex Osaka (Hall 4, Booth No. 18-78). Our company is a manufacturer of ultrasonic application devices with unique ultrasonic technology. We will propose devices that apply ultrasonic technology for joining, cutting, and welding, and we plan to introduce joining/welding technology and cutting technology as ultrasonic application technologies at the exhibition. Additionally, we will showcase a variety of samples processed with our devices from various fields, which we believe will be helpful in realizing new ideas and solving challenges. Exhibits: - Heat sink formation using pins/ribbons/block fins - Power module joining (terminal joining, terminal joining without patterns or with minimal patterns, inter-board joining) - DMB joining (harness joining on organic substrates, discrete devices, large area joining) - Flexible substrate joining (short-time joining, room temperature joining, low connection joining) - Ultrasonic cutting (cutting of soft multilayer materials, cutting of green sheets, slicing of TIM, cutting of active material coated electrodes) We sincerely look forward to your visit.
