Introducing the latest applications for power devices!
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From R&D for power devices to mass production. Providing ultrasonic bonding equipment!
Ultrasonic bonding devices used in various fields, such as power module terminal bonding and dissimilar metal bonding. At Adwells, we offer a lineup of "ultrasonic bonding devices" for a wide range of applications from R&D to mass production. Each device is compatible with terminal bonding, heat sink formation, DMB bonding, and more. We also conduct evaluation tests with demo units, so if you are interested, please contact us using the form below. 【Features of the device】 Terminal Bonding - Covers optimal bonding conditions for various terminals with a single device - Starts bonding by pressing down on the float with grounding load Heat Sink Formation - Directly forms fins (pins/ribbons) on the back surface of the substrate - High thermal conductivity (37 times that of TIM) due to direct bonding DMB Bonding - Can bond materials that can only handle low load and low output - No surface damage to materials during bonding: patternless horn - High thermal conductivity: about 7 times that of solder - Large area bonding *For more details, please refer to the PDF document or feel free to contact us.
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News about this product（2）
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Notice of Participation in "JPCA Show 2025" from June 4 (Wednesday) to June 6 (Friday), 2025.
Adwells Co., Ltd. will be exhibiting at the "JPCA Show 2025 (Total Solution Exhibition for Electronic Devices)" held at Tokyo Big Sight. At the exhibition, we will introduce ultrasonic application technologies such as heat sink formation, power module bonding, DMB bonding, flexible substrate bonding, and ultrasonic cutting. Additionally, we plan to display a variety of samples processed with our equipment from various fields, which we believe will be helpful in realizing new ideas and solving challenges. We invite you to visit our booth when you attend the event.
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"May 14 (Wednesday) to May 16 (Friday), 2025" Announcement of participation in the "9th Adhesive and Joining EXPO (Osaka)" (Hall 4, Booth No. 18-78)
Adwells Co., Ltd. will be exhibiting at the "9th Adhesive and Joining EXPO (Osaka)" held at Intex Osaka (Hall 4, Booth No. 18-78). Our company is a manufacturer of ultrasonic application devices with unique ultrasonic technology. We will propose devices that apply ultrasonic technology for joining, cutting, and welding, and we plan to introduce joining/welding technology and cutting technology as ultrasonic application technologies at the exhibition. Additionally, we will showcase a variety of samples processed with our devices from various fields, which we believe will be helpful in realizing new ideas and solving challenges. Exhibits: - Heat sink formation using pins/ribbons/block fins - Power module joining (terminal joining, terminal joining without patterns or with minimal patterns, inter-board joining) - DMB joining (harness joining on organic substrates, discrete devices, large area joining) - Flexible substrate joining (short-time joining, room temperature joining, low connection joining) - Ultrasonic cutting (cutting of soft multilayer materials, cutting of green sheets, slicing of TIM, cutting of active material coated electrodes) We sincerely look forward to your visit.
