Green Sheet Cutter GC1000MS
![[Device Category] Ultrasonic Welding Device](https://image.mono.ipros.com/public/premium/image_category/a8a/1430943/IPROS64786709892895228434.png?w=140&h=140){kind=small}
![[Device Category] Ultrasonic Cutter](https://image.mono.ipros.com/public/premium/image_category/a8a/1430943/IPROS09531302303078425129.png?w=140&h=140){kind=small}
![[Device Category] Ultrasonic Welding Device](https://image.mono.ipros.com/public/premium/image_category/a8a/1430943/IPROS18280580037540925390.png?w=140&h=140){kind=small}
Equipped with process monitoring features! A green sheet cutter that accommodates everything from fine devices to 6mm thick materials.
The "GC1000MS" is a green sheet cutter capable of handling everything from fine cuts to vertical cuts of thick materials. By reducing cutting load, it achieves vertical cuts. The optional ultrasonic assist function reduces the cutting load on the blade, enabling vertical cuts of thick materials. Additionally, it is equipped with a process monitoring function that allows for detailed understanding of process operations through various sensor information built into the device, making it effective for process startup and mass production management. 【Features】 ■ Capable of handling fine cuts to vertical cuts of thick materials ■ Achieves vertical cuts by suppressing elastic deformation ■ Precise positioning for component patterns using image recognition function ■ Equipped with process monitoring function *For more details, please refer to the PDF document or feel free to contact us.
basic information
【Specifications (Partial)】 ■ Cutting Method: Blade Push Cut (Optional: Ultrasonic Cut) ■ Target Workpiece ・ Material: Ceramic Green Sheet ・ Size: Maximum 225mm ・ Thickness: Maximum 6mm ・ Alignment Mark: Top/ Side ■ Equipment Size: W1100 x D1200 x H1600mm ■ Equipment Weight: 1000kg *For more details, please refer to the PDF document or feel free to contact us.
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Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
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News about this product（3）
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Notice of Participation in "JPCA Show 2025" from June 4 (Wednesday) to June 6 (Friday), 2025.
Adwells Co., Ltd. will be exhibiting at the "JPCA Show 2025 (Total Solution Exhibition for Electronic Devices)" held at Tokyo Big Sight. At the exhibition, we will introduce ultrasonic application technologies such as heat sink formation, power module bonding, DMB bonding, flexible substrate bonding, and ultrasonic cutting. Additionally, we plan to display a variety of samples processed with our equipment from various fields, which we believe will be helpful in realizing new ideas and solving challenges. We invite you to visit our booth when you attend the event.
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"May 14 (Wednesday) to May 16 (Friday), 2025" Announcement of participation in the "9th Adhesive and Joining EXPO (Osaka)" (Hall 4, Booth No. 18-78)
Adwells Co., Ltd. will be exhibiting at the "9th Adhesive and Joining EXPO (Osaka)" held at Intex Osaka (Hall 4, Booth No. 18-78). Our company is a manufacturer of ultrasonic application devices with unique ultrasonic technology. We will propose devices that apply ultrasonic technology for joining, cutting, and welding, and we plan to introduce joining/welding technology and cutting technology as ultrasonic application technologies at the exhibition. Additionally, we will showcase a variety of samples processed with our devices from various fields, which we believe will be helpful in realizing new ideas and solving challenges. Exhibits: - Heat sink formation using pins/ribbons/block fins - Power module joining (terminal joining, terminal joining without patterns or with minimal patterns, inter-board joining) - DMB joining (harness joining on organic substrates, discrete devices, large area joining) - Flexible substrate joining (short-time joining, room temperature joining, low connection joining) - Ultrasonic cutting (cutting of soft multilayer materials, cutting of green sheets, slicing of TIM, cutting of active material coated electrodes) We sincerely look forward to your visit.
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We will be exhibiting at the 18th Battery Japan [Spring] International Secondary Battery Exhibition at Tokyo Big Sight - showcasing dry environment-compatible samples, all-solid-state battery samples, electrode shape cut/separator welding samples, DMB bonding samples, and multilayer foil bonding samples.
We will be exhibiting at the 18th Battery Japan [Spring] International Secondary Battery Expo, which will be held at Tokyo Big Sight starting from February 19, 2025 (Wednesday). On that day, we will introduce ultrasonic application technologies, including dry environment compatibility, all-solid-state batteries, electrode shape cutting/separator welding, DMB bonding, and multilayer foil bonding. We will also display a variety of samples processed with our equipment from various fields, which we believe will help in realizing new ideas and solving challenges. We invite you to visit our booth when you attend.
