Ultrasonic cutting contract processing service
Ultrasonic cutting technology that achieves a clean cut surface without warping, bending, or dragging of composite materials.
Our company manufactures and sells "ultrasonic cutters" and also provides contract processing services. By applying ultrasonic waves to the cutting tool, we significantly reduce cutting load. This prevents dragging of composite materials and multilayer structures, achieving clean cross-sections without material deformation, burrs, or warping. We can achieve high-quality cutting even for materials that are difficult to cut precisely, such as resins, rubber, metal foils, and pre-fired ceramic materials. We accommodate not only straight blades but also shaped blades, offering a lineup from standalone models to those for mass production. 【Application Examples】 - Li batteries (cutting multilayer and single-layer foils) - Cutting of active material-coated electrodes - Thick copper cutting - TIM slice cutting - Green sheet cutting - Laminated film cutting - Soft material cutting - All-solid-state battery cutting *For more details on our products and services, please refer to the catalog.
basic information
This type of processing can be performed: ◎ Half-cut of film materials ◎ Cutting of complex shapes ◎ Smooth cutting of resin materials ◎ Vertical cutting of soft materials ◎ Thin and uniform slicing of soft materials *For more details, please refer to the materials. Feel free to contact us as well.
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Delivery Time
Applications/Examples of results
*For more details, please refer to the materials. Feel free to contact us as well.*
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Notice of Participation in "JPCA Show 2025" from June 4 (Wednesday) to June 6 (Friday), 2025.
Adwells Co., Ltd. will be exhibiting at the "JPCA Show 2025 (Total Solution Exhibition for Electronic Devices)" held at Tokyo Big Sight. At the exhibition, we will introduce ultrasonic application technologies such as heat sink formation, power module bonding, DMB bonding, flexible substrate bonding, and ultrasonic cutting. Additionally, we plan to display a variety of samples processed with our equipment from various fields, which we believe will be helpful in realizing new ideas and solving challenges. We invite you to visit our booth when you attend the event.
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"May 14 (Wednesday) to May 16 (Friday), 2025" Announcement of participation in the "9th Adhesive and Joining EXPO (Osaka)" (Hall 4, Booth No. 18-78)
Adwells Co., Ltd. will be exhibiting at the "9th Adhesive and Joining EXPO (Osaka)" held at Intex Osaka (Hall 4, Booth No. 18-78). Our company is a manufacturer of ultrasonic application devices with unique ultrasonic technology. We will propose devices that apply ultrasonic technology for joining, cutting, and welding, and we plan to introduce joining/welding technology and cutting technology as ultrasonic application technologies at the exhibition. Additionally, we will showcase a variety of samples processed with our devices from various fields, which we believe will be helpful in realizing new ideas and solving challenges. Exhibits: - Heat sink formation using pins/ribbons/block fins - Power module joining (terminal joining, terminal joining without patterns or with minimal patterns, inter-board joining) - DMB joining (harness joining on organic substrates, discrete devices, large area joining) - Flexible substrate joining (short-time joining, room temperature joining, low connection joining) - Ultrasonic cutting (cutting of soft multilayer materials, cutting of green sheets, slicing of TIM, cutting of active material coated electrodes) We sincerely look forward to your visit.