Gap-filling thermal conductive paste for chipsets 'HP-01'
A new option for thermal conductive materials! It is clay-like and easy to handle, making it suitable for filling uneven surfaces.
The "HP-01" is a gap-filling thermal conductive paste that can be used between chipsets such as CPU, GPU, M.2 SSD, memory chips, and heat sinks. Its adjustable shape makes it suitable for filling uneven surfaces. It can be used with chipsets on expansion cards, memory, motherboards, and more. Due to its flexible shape, it is also compatible with M.2 SSDs of sizes such as 2230, 2242, and 2260. It can be used for various applications. 【Features】 - Insulating and flame-retardant properties - Non-adhesive, so it does not damage the surface of items that need cooling - Ideal for filling uneven surfaces - Usable according to the chipset - Can be freely shaped, making it versatile for various applications *For more details, please refer to the related links or feel free to contact us.
basic information
【Specifications (Partial)】 ■ Thermal conductivity: 6.0 W/m·K ■ Thermal resistance value: 0.025 °C·in²/W ■ Operating temperature: -20 to 150 °C ■ Dielectric breakdown voltage: >2.5 kV/mm ■ Specific gravity: 3.2 g/cm³ *For more details, please refer to the related links or feel free to contact us.
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Our company handles front and rear I/O, drive accessories, internal power cables, and cooling fans. Please feel free to contact us if you have any requests.