Japan Bopixel Co., Ltd. Official site

Are you troubled by the power consumption and heat generation of your camera? [Catalog available]

With Japan Bopixel's "CoaXPress camera," it is possible to significantly reduce heat generation!

The transition from CCD to CMOS has accelerated the trend towards higher resolution, and the fps continues to increase, resulting in greater power consumption (and heat generation) of cameras. As a result, concerns about inspection accuracy due to thermal effects on lenses have increased, and the impact on objects and peripheral devices can no longer be ignored. At Japan Bopixel, we have successfully utilized "Ultra Low Power FPGA," which can reduce power consumption by over 50% compared to comparable FPGAs, instead of the FPGAs commonly adopted by most camera manufacturers, which are the main source of heat generation in industrial cameras. By fundamentally suppressing heat generation, we can significantly reduce the power consumption and heat of the camera, allowing us to solve thermal issues with a new approach that leverages the advantages of being a latecomer in the market. *For more details, please download the catalog or feel free to contact us.*

About the thermal superiority of CoaXPress cameras

basic information

■Area Scan Cameras 【29×29mm 1Lane Model】0.5M/2M/5.1M/8.1M/12.4M/16.2M/20.4M/24.6M/UV(8.1M) 【40×40mm 1Lane Model】3.2M/5M/8.9M/12M 【60×60mm 4Lane Model】16.2M/20.4M/24.6M 【25M CXP-12×4Lane Model】mono/color/NIR 【65M CXP-6/-12×4Lane Model】mono/color ■Line Scan Cameras 【2k CXP-10x1Lane Model】mono/color 【8k CXP-12x4Lane Model】mono/color 【9k CXP-12x4Lane Model】mono TDI line scan 【16k CXP-12x4Lane Model】mono

Price range

Delivery Time

Applications/Examples of results

Semiconductor front-end/back-end visual inspection, final visual inspection of semiconductor components, visual inspection of assembled boards, various alignments, and industrial image processing focused on semiconductors and electronics.

Detailed information

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