Prevent deterioration of inspection accuracy due to thermal expansion | Low-heat CoaXPress camera
With Japan Bopixel's "CoaXPress camera," it is possible to significantly reduce heat generation!
When the camera overheats excessively, the following issues arise, directly affecting inspection accuracy. - Suppression of thermal noise (hot pixels) As the temperature of the CMOS sensor rises, dark current increases, making random noise more likely to occur. By controlling heat generation, these thermal noises can be fundamentally suppressed, improving image quality. This reduces the effort required for software noise correction and the risk of false detections. - Stabilization of the optical system Heat from the camera body can transfer to adjacent lenses and housings, causing thermal expansion. This can lead to slight variations in the focal length and imaging position of the lens, resulting in misalignment and decreased inspection accuracy in precise inspections. The lower the heat generation, the less this thermal impact, allowing for stable inspection accuracy to be maintained over extended periods. *For more details about each product, please download the catalog or feel free to contact us.*
basic information
■Area Scan Camera 【29×29mm 1Lane Model】0.5M/2M/5.1M/8.1M/12.4M/16.2M/20.4M/24.6M/UV(8.1M) 【40×40mm 1Lane Model】3.2M/5M/8.9M/12M 【60×60mm 4Lane Model】16.2M/20.4M/24.6M 【25M CXP-12×4Lane Model】mono/color/NIR 【65M CXP-6/-12×4Lane Model】mono/color ■Line Scan Camera 【2k CXP-10x1Lane Model】mono/color 【8k CXP-12x4Lane Model】mono/color 【9k CXP-12x4Lane Model】mono TDI line scan 【16k CXP-12x4Lane Model】mono
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Applications/Examples of results
Semiconductor front-end/back-end visual inspection, final visual inspection of semiconductor components, visual inspection of assembled boards, various alignments, and industrial image processing focused on semiconductors and electronics.
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We focus on the design, development, manufacturing, and sales of high-speed, high-resolution, and highly reliable machine vision cameras primarily using CoaXPress and CameraLink. In addition to developing standard products, we also offer development and customization tailored to customer requests. All camera design and development is carried out by our Japanese staff, ensuring design and production techniques that guarantee delicate and highly reliable standards in Japan, while integrating the dynamic action and speed of China to provide competitive products. At Japan Bopixel, we have successfully become the first camera manufacturer to utilize Ultra Low Power FPGA instead of the standard FPGA adopted by the majority of camera manufacturers. This Ultra Low Power FPGA reduces power consumption by over 50% compared to similar class FPGAs, significantly lowering power consumption and heat generation in cameras by addressing the heat source at its root. By actively adopting these next-generation key devices, we are taking a new approach to the heat generation issues that have traditionally been a challenge.