Multi-layout wrapping system 'Trinity-Y'
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You can build a highly functional processing system without waste.
The multi-layout multifunctional wrapping system "Trinity-Y" is a device developed to accommodate next-generation materials such as wide-gap semiconductors. It allows for the flexible selection of mechanisms optimal for various new materials, consolidating these functions into a single unit to achieve space-saving design and build a highly functional processing system without waste. For more details, please contact us or download the catalog.
basic information
【Specifications】 [Vertical Grinding Device] ○ Vacuum Chuck Size: φ250, SUS ○ Grinding Wheel Size: φ200, SUS ○ Grinding Wheel Speed: Max 2,000rpm ○ Workpiece Speed: Max 400rpm [Lap Mechanism] ○ Polishing Plate Outer Diameter: φ380mm ○ Plate Speed: Max 100rpm ○ Pressing Head: φ140* 1 Axis ○ Facing Method: Hydraulic Slider [Scrub Mechanism] ○ Chuck Method: Pin Type ○ Speed: Max 300rpm ○ Wafer Size: Compatible with φ4-8″ Wafers ○ Brush Material: PVA Sponge φ30mm ● For more details, please contact us or download the catalog.
Price information
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Delivery Time
Applications/Examples of results
For more details, please contact us or download the catalog.
