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[Example] From prototype assembly of an innovative radiation detection device to mass production.
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[Case Study] Utilization of High-Precision Die Bonders in Electronic Coast
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[Example] Die bonder compatible with stacking implementation of membrane chips with post-bonding accuracy of 1 micron.
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[Case Study] High-Power Semiconductor Laser Assembly for Mars Rover at Quantel Corporation
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Case: Brain implants offer new hope for epilepsy patients.
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High-precision die bonder and flip chip bonder 'lambda2'
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High-precision die bonder, flip chip bonder model name sigma
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High-precision die bonder, flip chip bonder model name femto2
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![[Example] From prototype assembly of an innovative radiation detection device to mass production.](https://image.mono.ipros.com/public/catalog/image/01/0fb/594322/IPROS02881844820013023706.jpeg?w=120&h=170)
![[Case Study] Utilization of High-Precision Die Bonders in Electronic Coast](https://image.mono.ipros.com/public/catalog/image/01/a85/594321/IPROS75515410189022132068.jpeg?w=120&h=170)
![[Example] Die bonder compatible with stacking implementation of membrane chips with post-bonding accuracy of 1 micron.](https://image.mono.ipros.com/public/catalog/image/01/e2f/594320/IPROS45151851304018076153.jpeg?w=120&h=170)
![[Case Study] High-Power Semiconductor Laser Assembly for Mars Rover at Quantel Corporation](https://image.mono.ipros.com/public/catalog/image/01/8e3/594316/IPROS15015522107510416089.jpeg?w=120&h=170)
![[Example] Everything at a glance](https://image.mono.ipros.com/public/catalog/image/01/5b9/594312/IPROS77297817879235459514.jpeg?w=120&h=170)
