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FINEPLACER lambda2

FINEPLACER sigma

FINEPLACER pico2

FINEPLACER femto2

FINEPLACER femto(blu)

Dai Bonder

Flip chip bonder

R&D and small-scale production applications

Full auto model

Semi-automatic model

Manual model

Small tabletop model

Independent enclosure model

Ultra-high precision (<0.5μm)

High precision (>0.5μm)

Technical document presentation in progress.

【Usage Example】Presentation of Materials in Progress

Customer case materials being presented.

【 Technical Blog 】