Thank you for attending: IEEE 3DIC@Sendai 9/25-9/27

ファインテック日本

Thanks to all of you, we were able to successfully conclude this exhibition. I would like to express my heartfelt gratitude, and I sincerely thank everyone who visited us. We look forward to your continued support. We are honored to have the opportunity to exhibit at the IEEE International 3D Systems Integration Conference (3DIC). We hope to engage with many guests while participating in this platform for presenting cutting-edge technologies related to semiconductor processes.

Date and time Wednesday, Sep 25, 2024 ～ Friday, Sep 27, 2024
10:00 AM ～ 05:00 PM
Capital Sendai International Hotel 2nd Floor Exhibition Hall
Entry fee Free

Related product information

High-precision die bonder and flip chip bonder 'lambda2'
High-precision die bonder compatible with submicron technology. Compact tabletop model for prototyping, small-scale production, and research and development purposes.

【Main Specifications】 ○ Mounting Accuracy: 0.5μm ○ Optical Field of View Range: 0.54mm×0.43mm (minimum), 6.6mm×5.28mm (maximum) ○ θ Fine Adjustment Range: ±15° ○ Z Height Adjustment Range: 10mm ○ Working Area: 190mm×52mm ○ Load Range: 0.1N to 400N ○ Maximum Heating Temperature: 450℃ ○ Device Size: 660mm×610mm×640mm (main unit) ○ Compatible with formic acid gas processes *For more details, please refer to the catalog or feel free to contact us.
Multipurpose Die Bonder / Flip Chip Bonder "pico 2"
Compatible with various assembly processes such as adhesives, soldering, heat pressing, and ultrasonic methods! Suitable for rapid and flexible product development and prototype creation.

【Other Features】 ■ Observation of running processes ■ Access to all processes and easy visual programming via touchscreen operation ■ Individual configuration through process modules ■ Device variations with options for full auto or semi-auto ■ Wide bonding area *For more details, please refer to the PDF document or feel free to contact us.
High-precision die bonder/flip chip bonder 'sigma'
The FINEPLACER sigma is the top model of semi-automatic flip chip bonders/die bonders, encompassing high precision and high functionality.

【Main Specifications】 ○ Mounting Accuracy: ±0.5μm ○ Optical Field of View Range: 3.8mm (expanded 83mm) x 2.7mm ○ Optical Field of View Resolution: 1μm/pix ○ Compatible Chip Size: 0.1mm x 0.1mm to 80mm x 100mm ○ Maximum Compatible Substrate Size: 300mm x 300mm ○ θ Adjustment Range: ±15° (±2° fine adjustment) ○ Z Height Adjustment Range: 10mm ○ Working Area: 440mm x 150mm ○ Maximum Bonding Load: 1000N ○ Maximum Heating Temperature: 450℃ ○ Compatible with Vacuum Chamber Process ● For more details, please contact us or download the catalog.
High-precision flip chip bonder 'femto2'
Fully automatic high-precision die bonding machine

【Main Specifications】 ○ Mounting Accuracy: ±0.3μm @ 3Sigma ○ Optical Field of View: 3.8mm x 2.7mm ○ Optical Field of View Resolution: 1μm/pix ○ Supported Chip Size (Minimum): 0.03mm x 0.03mm to 100mm x 100mm ○ θ Fine Adjustment: ±9°/ 3.5μrad ○ Z Movement / Accuracy: 10mm / 0.2μm ○ Y Movement / Accuracy: 150mm / 0.02μm ○ X Movement / Accuracy: 660mm / 0.02μm ○ Substrate Heating Temperature: 500℃ ○ Bonding Load Range: 0.05N to 1000N *For more details, please contact us or download the catalog.