Solving heat issues in data centers! Heat dissipation sheet processing.
We offer a one-stop solution for thermal management sheets ideal for CPUs and GPUs, from material selection to shape processing and mass production supply.
With the increasing performance of AI servers and high-performance servers, the heat generation from components such as CPUs and GPUs has risen, making thermal management an important design challenge. Thermal interface materials (TIM) fill the tiny gaps between heat-generating components and heat sinks, efficiently transferring heat to the heat sink or enclosure. At our company, we provide one-stop solutions from selecting thermal interface materials based on heat generation, gaps, and usage environments, to shape processing tailored to the installation locations. We offer solutions for thermal challenges in various heat-generating areas, including CPUs, GPUs, VRAM/HBM, VRM/MOSFETs, SSDs, power units, and circuit boards/enclosures.
basic information
We will propose suitable thermal conductive sheets by comprehensively considering thermal conductivity, thickness, hardness/compressibility, electrical insulation, environmental resistance/reliability, etc., according to the application and heat generation conditions. Processing options include square and irregular cutting, hole and notch cutting, multiple piece processing, tabbed processing, as well as adhesive processing, laminating, and half-cutting. We can accommodate processing tailored to component shapes and assembly processes. Additionally, we support not only sheet supply but also roll supply, providing extensive support from prototyping to mass production. You can consult us consistently from material selection to shape processing and supply forms.
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Model number/Brand name
Punching processing of heat dissipation sheets proposed by Olympic Packing Co., Ltd.
Applications/Examples of results
■CPU・GPU: Heat transfer between high-heat components and heat sinks ■GPU peripheral VRAM/HBM: Gap measures between multiple memory and heat sinks ■VRM・MOSFET and other power circuits: Heat dissipation and insulation measures for power circuit components ■SSD and storage peripherals: Heat measures for controllers and NAND, etc. ■Power supply unit and power semiconductors: Heat dissipation measures for high-heat and high-voltage components ■Back of the substrate, casing, and backplate: Heat transfer and insulation measures to the casing We propose specifications that are processed into shapes suitable for the mounting locations, such as square, irregular shapes, holes, cutouts, with tabs, and consider assembly and mass production.
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Since our establishment, we have been providing and proposing rapid and accurate packing technologies, regardless of industry or sector. By swiftly strengthening the establishment of a platform revenue base and accommodating various advanced technologies, we have achieved remarkable development. Utilizing indispensable packing technologies, which are often hidden parts of products, we will continue to strive with all our employees to enhance your satisfaction as our motto.