Solving thermal issues in data centers for IT infrastructure! Heat dissipation sheet processing.
We offer one-stop solutions for heat dissipation sheets ideal for thermal management of CPUs and GPUs, from material selection to shape processing and mass production supply.
In the IT infrastructure industry, particularly in server cooling, addressing the increased heat generation from high-performance components such as CPUs and GPUs has become a crucial design challenge. Thermal interface materials (TIM), which fill the tiny gaps between these heat-generating parts and heat sinks to efficiently transfer heat, are essential for the stable operation of servers. At Olympic Packing, we provide a one-stop solution from selecting the appropriate thermal interface material based on heat generation, gap size, and usage environment, to custom shaping for specific installation locations, helping to solve thermal challenges in data centers. 【Usage Scenarios】 - AI servers, high-performance server CPUs and GPUs - VRAM/HBM, VRM, MOSFETs - SSDs, power units - Circuit boards, enclosures 【Benefits of Implementation】 - Suppression of temperature rise in heat-generating components - Stable operation and performance maintenance of servers - Increased efficiency in thermal design
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【Features】 - Optimal selection of thermal conductive sheets based on application and heat generation conditions (considering thermal conductivity, thickness, hardness/compressibility, electrical insulation, environmental resistance/reliability, etc.) - Processing tailored to component shapes, including square and irregular cutouts, holes, notches, multiple parts, and tabbed processing - Support for adhesive processing, lamination, and half-cutting, enabling processing that aligns with assembly processes - Support for both sheet and roll supply, providing comprehensive support from prototyping to mass production - A consistent consultation system from material selection to shape processing and supply form 【Our Strengths】 Olin Packing specializes in die-cutting of soft materials, realizing our customers' "desired shapes" with reliable technology. We support designers with material selection and prototyping proposals, while providing a system that can handle stable procurement and alleviate cost concerns for purchasing departments, from small lots to mass production. For manufacturing, we contribute to improved assembly and quality on-site with processing precision that emphasizes ease of handling. As a trusted partner supporting our customers' manufacturing, we continue to engage in meticulous production.
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Heat dissipation sheet punching processing proposed by Gorin Packing Co., Ltd.
Applications/Examples of results
■CPU・GPU: Heat transfer between high-heat components and heat sinks ■GPU peripheral VRAM/HBM: Gap measures between multiple memory and heat sinks ■VRM・MOSFET and other power circuits: Heat dissipation and insulation measures for power circuit components ■SSD and storage peripherals: Heat measures for controllers and NAND, etc. ■Power supply unit and power semiconductors: Heat dissipation measures for high-heat and high-voltage components ■Back of the circuit board, casing, and backplate: Heat transfer and insulation measures to the casing We propose specifications that are processed into shapes suitable for the mounting locations, such as rectangular, irregular shapes, holes, cutouts, tabbed, and laminated, while also considering assembly and mass production.
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Since our establishment, we have been providing and proposing rapid and accurate packing technologies, regardless of industry or sector. By swiftly strengthening the establishment of a platform revenue base and accommodating various advanced technologies, we have achieved remarkable development. Utilizing indispensable packing technologies, which are often hidden parts of products, we will continue to strive with all our employees to enhance your satisfaction as our motto.