GLIDCOP®

Dispersion strengthening of base copper with alumina fine particles.

Oxide dispersion strengthened (ODS) copper alloy that possesses both high strength and high conductivity, which are contradictory elements in other copper alloys.

basic information

**Features** - Alumina microparticles remain stable even under high-temperature conditions. They can prevent the crystallization and recrystallization of particles when exposed to high temperatures for extended periods, maintaining their ability to strengthen the copper matrix. - A variety of specifications with different oxide content are available to allow for the selection of strength and conductivity according to application needs. - They possess a very strong resistance to recrystallization of grain boundaries and softening due to heating. - High electrical conductivity and thermal conductivity. - High tensile strength and yield strength at room temperature. - High strength at elevated temperatures. - High stress rupture strength at elevated temperatures. - Non-weldability with steel during resistance welding. - Resistance to degradation from radiation. *You can view application examples from the "Catalog Download."* For other functions and details, please contact us.