Announcement of the Introduction of FIB-SEM Helios 5 UC

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The introduction of the "FIB-SEM Helios 5 UC" is scheduled to start service in November. We will provide shorter delivery times and reliable feedback than before. We will achieve high-throughput cross-sectional observation and analysis of a wide range of materials, from semiconductor devices such as power devices, ICs, solar cells, and light-emitting elements to electronic components like MLCCs and soft materials. With a high-quality beam of up to 100nA, we can process large areas at high speed, and by finishing the FIB at low acceleration, it is possible to produce high-quality samples with minimal damage layers. You can view related products and catalogs.

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Announcement of the Introduction of FIB-SEM Helios 5 UC
Cross-section production of soft materials has also been realized! 3D reconstruction is possible with Auto Slice & View!

【Overview of FIB-SEM Composite Device】 ■ SEM column mounted vertically and FIB column mounted diagonally ■ Real-time observation of FIB processing using SEM ■ Improved processing position accuracy ■ Observation and analysis possible without exposure to the atmosphere *For more details, please refer to the PDF document or feel free to contact us.