Surface observation of IC chips implemented on LCD panels.
アイテス
We will introduce a case where precision planar grinding was applied to remove wiring and conductive particles from a glass substrate, allowing for the observation of IC chip circuits with minimal damage. Careful planar grinding was performed from the glass substrate side, removing material up to a few micrometers in front of the IC chip, enabling the observation of the circuit surface. The IC chip circuit surface was clearly visible, and detailed observation at high magnification became possible. There are many samples, like the one in this case, where detailed observation has been made possible through planar grinding, as well as samples that can undergo FIB processing or CP processing. If you have any samples that are causing you trouble, please consult with us. We accept requests for planar grinding only, as well as requests that include observation and analysis. For more details, please refer to the related products and catalogs below.
