Surface observation of IC chips implemented on LCD panels.
The observation target is an IC chip connected to the LCD panel using the COG mounting method! The circuit surface was clearly visible.
We will introduce a case where precision planar grinding was applied to remove glass substrate wiring and conductive particles, allowing for the observation of IC chip circuits with minimal damage. Careful planar grinding was performed from the glass substrate side, removing material down to a few micrometers from the IC chip, enabling the observation of the circuit surface. The IC chip circuit surface was clearly visible, and detailed observation at high magnification became possible. There are many samples, like the one in this case, where detailed observation has become possible through planar grinding, as well as samples that can be processed using FIB or CP techniques. If you have any samples you are struggling with, please consult us. We accept requests for planar grinding only, as well as requests that include observation and analysis. [Overview] <Planar Grinding and Optical Observation> ■ Careful planar grinding was performed from the glass substrate side, removing material down to a few micrometers from the IC chip, enabling the observation of the circuit surface. ■ The IC chip circuit surface was clearly visible, and detailed observation at high magnification became possible. *For more details, please refer to the PDF document or feel free to contact us.
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【Other Overview】 <IC Chip of the LCD Panel> ■ The subject of observation is the IC chip connected to the LCD panel using the COG mounting method. ■ The IC chip is bonded to the glass substrate with ACF, and the structure does not allow for the removal of the IC chip. ■ An attempt was made to observe the circuit side of the IC chip through the glass substrate, but it was obstructed by the wiring on the glass substrate and conductive particles, making it impossible to confirm the circuit side of the IC chip. *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Observation of Conductive Particle Shape in COG Implementation
We will introduce the observation of the shape of conductive particles in COG implementation. ICs and liquid crystal panels are implemented using the COG method with ACF (anisotropic conductive film). A resin ball is used as the core, and a metal layer (such as nickel or gold) for conductivity is deposited on its surface. During connection, the particles deform appropriately to electrically connect the IC and the panel. To confirm the degree of particle deformation and connection status, cross-sectional observations were conducted, revealing that the particle deformation was at a "medium" level, indicating an appropriate degree of deformation. By examining the deformation of conductive particles from both the planar and cross-sectional directions, we can explore the correlation with display defects. Please feel free to contact us for any inquiries regarding panel-related defects.
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Surface observation of IC chips implemented on LCD panels.
We will introduce a case where precision planar grinding was applied to remove wiring and conductive particles from a glass substrate, allowing for the observation of IC chip circuits with minimal damage. Careful planar grinding was performed from the glass substrate side, removing material up to a few micrometers in front of the IC chip, enabling the observation of the circuit surface. The IC chip circuit surface was clearly visible, and detailed observation at high magnification became possible. There are many samples, like the one in this case, where detailed observation has been made possible through planar grinding, as well as samples that can undergo FIB processing or CP processing. If you have any samples that are causing you trouble, please consult with us. We accept requests for planar grinding only, as well as requests that include observation and analysis. For more details, please refer to the related products and catalogs below.
