アイテス Official site

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Examples of observing intermetallic compounds through etching treatment.

アイテス

アイテス

The method of processing the observation samples may result in different information being obtained. You may have observed the solder joints in two dimensions from a cross-section, but have you ever wondered how the compounds are growing in three dimensions? In this document, we present examples of observations of the Cu pad and solder joint. We include both "cross-sectional observation" and "planar observation." For more details, please refer to the related products and catalogs below.

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Examples of observing intermetallic compounds through etching treatment.

TECHNICAL

Analysis of the assembly joints of the implemented components

PRODUCT

Total support service for cross-section grinding, processing, observation, and analysis.

OTHER

The nature of analysis techniques, including defect analysis of joints, adhesion, and assembly parts.

TECHNICAL

Crystal analysis by EBSD: Intermetallic compounds in solder joints

PRODUCT

Cross-sectional polishing service for implementation parts and electronic components.

PRODUCT

Surface mount electronic component cross-sectional observation service

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Evaluation of BGA/CSP solder

OTHER