We would like to introduce an example of failure analysis of chip resistors where abnormalities were observed. Upon investigating the cause of the malfunction of the polishing table, abnormalities were confirmed in the chip resistors on the relevant circuit board. Surface observation revealed abnormalities in the chip resistors, and it appeared that the protective film was melted. Elemental analysis using EDX detected elements such as Al and Pb from the abnormal areas, suggesting that the undercoat layer may be exposed. Next, a cross-sectional sample was prepared through mechanical polishing, and analysis was conducted using SEM/EDX, which showed that the protective film and the resistive element appeared to be melted. It seems that the destruction of the overcoat layer allowed the undercoat layer and other components to be observed from the surface, and it is believed that due to a surge or overload, the temperature exceeded the heat resistance, causing the resistive element to melt and the resistance value to change (leading to an open circuit).

To prevent shock and vibration, low-rebound and vibration-absorbing materials are used in various situations. The indicator of these properties is viscoelasticity. This document presents examples of evaluating the rebound and vibration absorption properties of rubber materials through dynamic mechanical analysis (DMA). From the dynamic viscoelasticity concerning temperature, it is possible to predict the vibration absorption and rebound properties of materials in their usage environment. From the dynamic viscoelasticity concerning frequency, it can be utilized to predict damping performance against seismic motion, braking performance of tires, and in the low-frequency range, it can be used to predict long-term deformation behavior such as creep.

Our company conducts consistent analysis from reliability testing to failure analysis. This allows us to confirm whether the samples meet the specifications, as well as to identify and observe the defective areas of failed samples. We propose and implement tests and analyses tailored to our customers' requests and objectives, assisting from cause investigation to problem resolution. Please feel free to contact us when you need our services. 【Analysis Flow】 ■ Specification confirmation of semiconductor devices through reliability testing ■ Identification of defective areas and observation of failure locations using TEM ・ Identification of defective areas through EMS/OBIRCH analysis ・ Observation of failure locations using TEM

This document introduces examples of visualizing the internal state of capsules in three dimensions and obtaining elemental information data through EDX analysis of powders. In the X-ray CT analysis, it was observed that there were slight air gaps inside the capsule, and it was also visually confirmed that the particle size was not uniform, with some larger particles present. In the SEM-EDX analysis, elemental analysis was conducted on any particles contained within. At an acceleration voltage of 15kV, carbon (C), oxygen (O), calcium (Ca), chlorine (Cl), iron (Fe), phosphorus (P), and sodium (Na) were detected. [Analysis Details] ■ X-ray CT Analysis: X-ray transmission observation of the capsule ■ SEM-EDX Analysis: Elemental analysis of any particles contained within

We would like to introduce the dynamic viscoelastic measurement of CFRP conducted by our company using the bending mode. When performing dynamic viscoelastic measurements using DMA, CFRP is generally highly elastic, and it is considered that measurements using the bending mode are suitable due to its applications. The deformation modes of DMA can measure in any mode as long as the size requirements are met, but it is ideal to select appropriate conditions based on the material's shape, elastic modulus, and the purpose of the measurement. If you have any subjects for which you would like to measure dynamic viscoelasticity, please feel free to consult us. 【Measurement Modes】 ■ Tensile ■ Compression ■ Bending (Two-point/One-point/Three-point) ■ Shear

This is a case study that compares the methods for cross-section preparation on the surface coating layer of a golf ball and observes the effects of heat from CP processing. There are two layers of coating on the outermost layer of the cover layer, and a comparison of cross-section preparation methods was conducted using this coating layer. SEM observations of the cross-sections prepared by three different methods were performed. While cross-section preparation of soft materials is effectively done using cross-section ion milling (CP), the physical properties may change due to the heat generated during CP processing. In such cases, cross-section preparation using cryo-CP, which mitigates the effects of processing heat through cooling, is effective. 【Cross-section preparation methods】 ■ Mechanical polishing ■ CP ■ Cryo-CP (-50℃)

Our company will introduce the FEI "Talos F200E" transmission electron microscope system. Compared to conventional models, the resolution for TEM and STEM has improved, and performance has been significantly enhanced, allowing for EDS analysis with four detectors. Additionally, it is equipped with features such as drift-corrected frame integration (DCFI), which accumulates multiple frames while correcting for drift.

At Aites Co., Ltd., we conduct "Poisson's ratio measurement." Poisson's ratio is the ratio of longitudinal to lateral strain that occurs when a load is applied to an object, and it is necessary for strength calculations of materials. In the downloadable materials, we introduce the results of attaching strain gauges to test specimens, applying tensile loads using a universal testing machine, and examining the longitudinal and lateral strains obtained from the strain gauges. Please feel free to download and take a look.

This is a measuring device that can non-contact measure surface shapes such as concavities, undulations, and surface roughness. We will introduce "heating deformation observation" using a 3D shape measuring machine. First, we acquire a 3D texture image at room temperature, and then we acquire a 3D texture image in the heated state. By overlaying the texture images before and after heating and checking the differential texture image and cross-sectional profile, it can be seen that the substrate in the heated state has higher ends and a lower center compared to the room temperature state.

We will introduce a case where cross-sections were created and observed by method regarding the adhesive parts of the tires of pull-back cars. When conducting SEM observations of the created cross-sections, fillers present inside the rubber were confirmed. It was found that the dispersion state of the fillers and the condition of the adhesive interface were not clear with fracture by liquid nitrogen or mechanical polishing. In contrast, the cross-sections created by cryo ion milling allow for clear observation of the dispersion state of the fillers contained within the rubber and the condition of the adhesive interface with the plastic substrate.

We would like to introduce the "Tensile Property Evaluation using Extensometers for High-Elasticity Flexible Materials" that we offer. Tensile tests of NR rubber will be conducted using contact-type (suitable for high-elasticity and soft materials) and non-contact type (video) extensometers, and the results will be compared. To accurately determine strain in tensile tests, it is necessary to select the appropriate extensometer and testing conditions based on the target material and measurement objectives. We will provide suggestions tailored to your consultation needs.

We conducted measurements to reconfirm the temperature of heat generation during curing, following the change to a non-toxic epoxy resin. When using a large amount of resin, we apply heat generation prevention treatment for resin embedding. Without this treatment, the temperature can rise up to 138°C during curing. However, by applying the heat generation prevention treatment even with a large amount of resin, we were able to keep the heat generation during curing within 30°C.

Our company conducts "rubber thermal aging tests" that help evaluate the properties of materials in actual usage environments. Using a method compliant with JIS K6257 (Method for determining thermal aging characteristics of vulcanized rubber and thermoplastic rubber), rubber test pieces are suspended in a gear oven to create specimens with varying heat treatment times. Additionally, tensile tests are performed on heated natural rubber (NR) to investigate changes in mechanical properties, while hardness is measured simultaneously. Changes in the characteristics of the rubber are also examined, confirming that rubber elasticity is lost and the material becomes harder with heating.

Our "component analysis of organic substances" often utilizes FT-IR and GC/MS. In FT-IR measurements, it is possible to analyze the main components of organic substances by comparing the IR spectrum of known substances. Additionally, if you want to analyze not only the main components of unknown substances but also trace amounts of organic substances such as additives, we recommend conducting GC/MS measurements.

I would like to introduce "Observation of Substrate Deformation Using a 3D Shape Measuring Machine." By applying pressure to the PCB substrate, referencing bending tests of plastics and PCB substrates, the change in state is measured using a 3D shape measuring machine (VR-6200). Since the measurement results can be confirmed with a color palette and line profile, it is possible to visually verify the shape and amount of deformation caused by the applied pressure.

I would like to introduce "Cross-sectional observation of tracking camera using mechanical polishing." Regarding the structure of the tracking camera components, when viewed from above, the lens can be identified. Although it cannot be clearly seen in the X-ray image, the lens is incorporated into the convex part. Additionally, the cross-sectional structure is similar to that of an RGB sensor, featuring a back-illuminated CMOS structure. However, since color information is not necessary for the tracking camera, there is no color filter layer. A jagged uneven shape was observed on the surface of the photodiode.

At Aites Co., Ltd., we conduct "NMR analysis of liquid crystal compounds." NMR is an analytical method that reveals the connections between atoms that make up a molecule, and it is used alongside mass spectrometry and infrared spectroscopy for determining the structure of compounds. In the downloadable materials, we highlight the 1H NMR, 13C NMR, and DEPT measurements of 4-butoxy-4'-cyanobiphenyl (CAS number 52709-87-2), which is used as a liquid crystal component, and introduce the information obtained from NMR. Please feel free to download and take a look.

We would like to introduce our "Appearance Observation and Measurement Service." We are equipped with a variety of devices to meet your needs, including appearance observation before and after reliability testing, solder joint observation, as well as dimensional measurements and surface roughness measurements of various components. You can also leave the pre-observation processing to us. Our company has IPC-certified IPC specialists on staff. We provide assistance with observations, consultations, and solutions to various observation-related concerns in accordance with international standards.

At our company, we created a cross-section of the CMOS image sensor component associated with A company's VR goggles through mechanical polishing while keeping the component intact, and we conducted structural observations of the CMOS sensor component. During the observation of the sensor component structure and sensor surface, we removed the glass filter and observed the CMOS sensor surface, where it was noted that the arrangement of the color filters was in a configuration known as a Bayer filter. In addition to mechanical polishing, methods for creating cross-sections include processing with ion beams such as FIB and CP, as well as microtome methods. Consultations are free, so please feel free to contact us if you are unsure about the cross-section creation method.

We would like to present the results of strain measurements conducted by attaching strain gauges and thermometers to the surfaces of power modules, both in the mounted state on a circuit board and in the unmounted state. In the mounted module, a slight delay in temperature change was observed, and correspondingly, the change in strain also appeared to be delayed. This is believed to be due to the slower transfer of heat to the module when it is mounted. At Aites, we conduct temperature cycle tests and temperature-humidity cycle tests, during which we can simultaneously measure the strain occurring in the mounted components. Please feel free to consult with us.

I will introduce the three-dimensional reconstruction of failure locations using the Slice & View function of FIB-SEM. Continuous SEM images of the structure are obtained, and the resulting images are corrected for positional misalignment between the SEM images and visualized in three dimensions using 3D construction software (Avizo). By combining the position identification technique for cross-sectioning the failure location with the Slice & View function, it is possible to obtain continuous SEM images that retain the defective state and include information before and after the abnormal area.

We will introduce the observation of metallic structures through chemical treatment. By performing chemical treatment on metallic samples, it is possible to clearly observe the metallic structure. Observing the structure can reveal the condition of the sample and the history of applied heat and stress, providing clues about the quality of the product and any defects based on the structure's shape. In the catalog, you can find details on the observation of metallic structures, such as the macrostructure of aluminum plates and the soldered parts of copper terminals. Additionally, we offer other services such as cross-sectional observation and various analysis services. Please feel free to contact us if you have any requests.

At Aites Co., Ltd., we have newly introduced "Microscopic FT-IR" this fiscal year. The "Microscopic FT-IR," which combines FT-IR and optical microscopy, allows for the measurement of tiny substances on the order of several tens of micrometers, which are difficult to measure with conventional FT-IR, using an aperture (field of view diaphragm). There are three main measurement methods for Microscopic FT-IR: "transmission method," "reflection method," and "ATR method." While the transmission method is the basic measurement method in Microscopic FT-IR measurements, the reflection method or ATR method may be more suitable depending on the shape of the sample and the feasibility of sampling.

In the methods for cross-section preparation in semiconductor structure observation and defect analysis, CP, FIB, and mechanical polishing are mentioned, each having its own advantages and disadvantages, making it necessary to consider which method to use. In recent years, CP and FIB have become more common, and it seems that the use of mechanically polished methods, which require technical skill, is decreasing. However, it is still not something to be dismissed. While there are merits and demerits, it is possible to achieve cross-section preparation with mechanical polishing that is on par with FIB and CP. At our company, based on years of accumulated know-how, we propose the most appropriate processing method according to the observation purpose, sample composition, and structure.

We would like to introduce an example of cross-sectional observation of mounted components conducted by our company. Using commercially available computer circuit boards, we observed the solder joints of mounted components and the internal structure of the components with a metal microscope. The observation modes of the metal microscope include bright field observation, dark field observation, and polarized light observation, among others. Additionally, there are observations using transmitted light, and the observation mode is selected according to the sample. By conducting cross-sectional observations before and after reliability testing, we can evaluate the reliability of the product. When observing, it is important to select an appropriate "observation mode" to clearly capture the condition of the solder joint interface and defects such as cracks.

We would like to introduce the "strain measurement in thermal shock testing" conducted by our company. A sample with strain gauges attached was set up in the thermal shock testing device, and the wiring of the strain gauges was connected to an external data logger to record strain data in real time during the test. For two types of copper-clad laminates, the strain behavior during the thermal shock test was observed, and it was noted that significant strain occurred with changes in temperature. It was found that FR-1 exhibited greater strain compared to FR-4.

We would like to introduce a case of particle size measurement of positive electrode active materials using laser diffraction conducted by our company. In air or liquid, laser light is irradiated onto the particles, and the angular dependence of the intensity of the light scattered by the particles is measured. By measuring the angular dependence of the scattered light intensity, the particle size distribution (particle size distribution) is calculated from the data. Using commercially available reagents as samples, measurements were conducted in a dry state without dispersing in a solvent. The particle size measurement results for NMC oxide showed a monodisperse state with particle sizes below several tens of micrometers, and the median diameter was calculated to be 12 micrometers.

We will introduce examples of cross-sectional observations of various components mounted on a board called an organic substrate. Inside various electronic devices around us, there are substrates equipped with electronic components. When observing the mounted substrate, you can see that numerous components are tightly soldered together. It is necessary to verify that these components are properly joined, as they will not function correctly otherwise. Please contact us if you are considering observations before and after reliability testing or cross-sectional observations.

We would like to introduce our "Chemical Analysis - Trust Us Service." When conducting component analysis of foreign substances or stains on products, it can be challenging to determine whether organic analysis or inorganic analysis is more suitable, and which specific analysis within organic or inorganic is the most appropriate. We provide a comprehensive service for customers who are struggling with the selection of analysis methods. Since each analysis device can measure different targets, it is necessary to choose a method that fits the purpose based on the information available.

We will introduce the observation of the shape of conductive particles in COG implementation. ICs and liquid crystal panels are implemented using the COG method with ACF (anisotropic conductive film). A resin ball is used as the core, and a metal layer (such as nickel or gold) for conductivity is deposited on its surface. During connection, the particles deform appropriately to electrically connect the IC and the panel. To confirm the degree of particle deformation and connection status, cross-sectional observations were conducted, revealing that the particle deformation was at a "medium" level, indicating an appropriate degree of deformation. By examining the deformation of conductive particles from both the planar and cross-sectional directions, we can explore the correlation with display defects. Please feel free to contact us for any inquiries regarding panel-related defects.