Observation of substrate deformation using a 3D shape measuring device (VR-6200)

アイテス
I would like to introduce "Observation of Substrate Deformation Using a 3D Shape Measuring Machine." By applying pressure to the PCB substrate, referencing bending tests of plastics and PCB substrates, the change in state is measured using a 3D shape measuring machine (VR-6200). Since the measurement results can be confirmed with a color palette and line profile, it is possible to visually verify the shape and amount of deformation caused by the applied pressure.
