In-Situ Continuous Measurement Reliability Evaluation Testing Service
In-Situ Continuous Measurement Reliability Evaluation Testing Service
In-situ continuous measurement reliability evaluation tests involve applying stress while measuring characteristics to conduct reliability assessments. ● Accurate understanding of failure time is possible In a read-out method where samples are taken from a stress environment at a fixed time, failure can only be understood at the timing of the read-out, making it impossible to know the exact failure occurrence time. In-situ measurement allows for an accurate understanding of failure time. ● Detection of recoverable failures is possible Recoverable failures can cause significant issues in the market. In most cases, the read-out method makes it nearly impossible to detect these recoverable failures, whereas in-situ measurement enables the detection of recoverable failures, allowing for accurate judgment and assessment. ● Monitoring of stress application conditions on samples is possible The stress application status and measurement data can be confirmed in real-time.
basic information
In-Situ continuous measurement reliability evaluation tests involve applying stress while measuring characteristics to conduct reliability assessments. ● Accurate understanding of failure time is possible In a read-out method where samples are taken from a stress environment at fixed times, failure can only be understood at the timing of the read-out, making it impossible to know the exact time of failure occurrence. In-Situ measurement allows for an accurate understanding of failure time. ● Detection of recoverable failures is possible Recoverable failures can cause significant issues in the market. In most cases, the read-out method makes it nearly impossible to detect these recoverable failures, but In-Situ measurement enables the detection of recoverable failures, allowing for accurate judgment/assessment. ● Monitoring of stress application conditions on samples is possible The stress application status and measurement data can be confirmed in real-time.
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Applications/Examples of results
■In-Situ HAST Test/In-Situ THB Test (High-Acceleration High-Temperature High-Humidity Bias Test) Features: Continuous measurement of insulation resistance during high-temperature high-humidity bias testing is possible. Target Products: Printed circuit boards, semiconductor packages, etc. Evaluation Targets: Ion migration, etc. ■In-Situ TC Test (Temperature Cycle Test) Features: Continuous measurement of small resistance values/temperature during temperature cycle testing is possible. Target Products: Semiconductor packages, mounted substrates. Evaluation Targets: Solder joints, etc. ■In-Situ EM Test (High-Temperature Current Injection Test) Features: Current injection/resistance measurement/temperature measurement using resistors is possible during high-temperature testing. Target Products: Semiconductor packages, IC chips. Evaluation Targets: Solder joints, wiring, etc.
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Observation of substrate deformation using a 3D shape measuring device (VR-6200)
I would like to introduce "Observation of Substrate Deformation Using a 3D Shape Measuring Machine." By applying pressure to the PCB substrate, referencing bending tests of plastics and PCB substrates, the change in state is measured using a 3D shape measuring machine (VR-6200). Since the measurement results can be confirmed with a color palette and line profile, it is possible to visually verify the shape and amount of deformation caused by the applied pressure.
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In-chamber imaging during constant temperature and humidity testing.
Our company conducts environmental testing using a constant temperature and humidity chamber with a front glass window and a camera, allowing us to capture and monitor the operational status, such as screen displays, during the tests. During environmental testing using equipment like constant temperature and humidity chambers, monitoring the condition of the test subjects with loggers (for voltage, current, resistance, temperature, etc.) is widely practiced. However, monitoring the operational status of equipment during testing can be difficult unless the test equipment is equipped with dedicated external outputs. For samples where monitoring with loggers is challenging, we combine a constant temperature and humidity chamber with a front glass window option, a camera, and monitoring software to conduct environmental tests while capturing and monitoring the condition of the test equipment.
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IOL testing of discrete semiconductors
Our company conducts "IOL testing of discrete semiconductors." We repeatedly turn the power ON/OFF in a room temperature environment, applying stress to the device due to temperature changes caused by the device's own heat generation during power ON. During power OFF (cooling), forced cooling is also performed using a fan. Additionally, before conducting the tests, we use representative samples to make adjustments to reach the test temperature conditions. It is possible to adjust the current/time during heating and the fan capacity/timing during cooling.
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Strain measurement in thermal shock testing.
We would like to introduce the "strain measurement in thermal shock testing" conducted by our company. A sample with strain gauges attached was set up in the thermal shock testing device, and the wiring of the strain gauges was connected to an external data logger to record strain data in real time during the test. For two types of copper-clad laminates, the strain behavior during the thermal shock test was observed, and it was noted that significant strain occurred with changes in temperature. It was found that FR-1 exhibited greater strain compared to FR-4.
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Reverse bias test of power devices (up to 2000V)
At Aites Co., Ltd., high-temperature reverse bias testing (HTRB) for evaluating the oxide film and junction of power devices can be applied up to a maximum of 2000V. By monitoring the leakage current during the test, the degradation status of the device can be grasped in real-time. Since the power supply is independent, if one device fails during the test, it will not affect the other devices. Additionally, it is possible to set a failure criterion (current value) and to cut off the power supply to the device deemed faulty at the time of failure judgment. 【Specifications and Service Details】 ■ Test Voltage: Up to a maximum of DC 2000V ■ Applied Current: Up to a maximum of 14mA ■ Number of Test Devices: Up to a maximum of 8 (independent power supply) ■ Compatible Modules: TO-247, TO-220, etc. (other packages require consultation regarding connection methods) ■ Measurement Content: Monitoring of leakage current ■ Temperature Range: Up to a maximum of 200°C (85°C/85% in high temperature and high humidity conditions)
