Observation of substrate deformation using a 3D shape measuring machine (VR-6200)
Measure the change state with a 3D shape measuring device! Visually confirm the indented shape and amount due to pressure.
We would like to introduce the "Substrate Deformation Observation" using a 3D shape measurement machine. By applying pressure to a PCB substrate, referencing the bending tests of plastics and PCB substrates, we measure the changes using a 3D shape measurement machine (VR-6200). Since the measurement results can be confirmed with a color palette and line profile, it is possible to visually verify the shape and amount of deformation caused by the applied pressure. 【Features】 ■ Measurement results can be confirmed with a color palette and line profile ■ It is possible to visually verify the shape and amount of deformation caused by the applied pressure *For more details, please download the PDF or feel free to contact us.
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Observation of thermal deformation using a 3D shape measuring machine (VR-6200)
This is a measuring device that can non-contact measure surface shapes such as concavities, undulations, and surface roughness. We will introduce "heating deformation observation" using a 3D shape measuring machine. First, we acquire a 3D texture image at room temperature, and then we acquire a 3D texture image in the heated state. By overlaying the texture images before and after heating and checking the differential texture image and cross-sectional profile, it can be seen that the substrate in the heated state has higher ends and a lower center compared to the room temperature state.
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Observation of substrate deformation using a 3D shape measuring device (VR-6200)
I would like to introduce "Observation of Substrate Deformation Using a 3D Shape Measuring Machine." By applying pressure to the PCB substrate, referencing bending tests of plastics and PCB substrates, the change in state is measured using a 3D shape measuring machine (VR-6200). Since the measurement results can be confirmed with a color palette and line profile, it is possible to visually verify the shape and amount of deformation caused by the applied pressure.
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Aites was established in 1993, originating from the quality assurance department of the IBM Japan Yasu office. Based on the technical expertise cultivated through cutting-edge defect analysis and reliability assurance of electronic components at the IBM Japan Yasu office, we have provided various products and services that support the development and manufacturing of semiconductors, displays, organic EL, solar cells, and electronic components to customers both domestically and internationally.