Introduction to Reliability Assurance Services
We conduct reliability evaluation tests for various electronics products, components, and materials in accordance with standard specifications such as JIS, JEDEC, and MIL.
■High Accelerated Life Test: 5 units ■Thermal Shock Test: 24 units ■Constant Temperature and Humidity Test: 22 units ■Liquid Tank Thermal Shock Test: 3 units ■High Temperature Storage Test ■Hot Oil Resistance Evaluation Test ■Insulation Resistance Continuous Monitoring Evaluation ■Continuity Resistance Continuous Monitoring Evaluation ■Electromigration Continuous Monitoring Evaluation ■Microfocus X-ray Transmission Observation ■Ultrasonic Microscope Observation ■ESD Evaluation Test ■CDM Evaluation Test ■Universal Tensile Evaluation Test ■Cross-section (Polishing) Observation Service (Evaluation before and after environmental testing is also possible) ■Solar Cell (Crystalline Silicon/Amorphous Silicon/Compound/Organic Thin Film, etc.) EL Emission Phenomenon ■Heat Generation Observation
basic information
■ Highly Accelerated Life Test Internal dimensions (maximum) Φ545×L550mm Temperature and humidity range +105～162.2℃/75～100%RH ■ Thermal Shock Test Internal dimensions (maximum) W970×H460×D670mm Temperature range -65℃～0℃/+60℃～200℃ ■ Constant Temperature and Humidity Test Internal dimensions (maximum) W1000×H1000×D720mm Temperature and humidity range -70℃～+150℃/20～98%RH ■ Liquid Bath Thermal Shock Test Sample basket (maximum) W320×H240×D320mm Load capacity (maximum) 10kg Temperature range -65℃～0℃/+60℃～150℃
Price information
We will provide a quotation based on the examination conditions.
Delivery Time
Applications/Examples of results
Standards testing such as JIS, JEDEC, and MIL Testing under specified conditions as per meeting discussions Various In-Situ monitor linked tests
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Observation of substrate deformation using a 3D shape measuring device (VR-6200)
I would like to introduce "Observation of Substrate Deformation Using a 3D Shape Measuring Machine." By applying pressure to the PCB substrate, referencing bending tests of plastics and PCB substrates, the change in state is measured using a 3D shape measuring machine (VR-6200). Since the measurement results can be confirmed with a color palette and line profile, it is possible to visually verify the shape and amount of deformation caused by the applied pressure.
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Evaluation of various implementation substrates
At Aites Co., Ltd., we provide a wide range of technical services for evaluation tests of printed circuit boards (mounted boards) equipped with electronic components. We conduct reliability tests, solder joint observations, whisker observations, and cross-sectional observations. We have IPC-A-610 certified IPC specialists on staff who can assist with observations in accordance with international standards, consultations, and various observation-related concerns. Additionally, we offer services such as X-ray observations, appearance inspections, and shape measurements, so please feel free to consult with us when needed.
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In-chamber imaging during constant temperature and humidity testing.
Our company conducts environmental testing using a constant temperature and humidity chamber with a front glass window and a camera, allowing us to capture and monitor the operational status, such as screen displays, during the tests. During environmental testing using equipment like constant temperature and humidity chambers, monitoring the condition of the test subjects with loggers (for voltage, current, resistance, temperature, etc.) is widely practiced. However, monitoring the operational status of equipment during testing can be difficult unless the test equipment is equipped with dedicated external outputs. For samples where monitoring with loggers is challenging, we combine a constant temperature and humidity chamber with a front glass window option, a camera, and monitoring software to conduct environmental tests while capturing and monitoring the condition of the test equipment.
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Measurement of moisture absorption distortion
We would like to introduce the results of our investigation into the behavior of strain during moisture absorption and drying using a strain gauge. It was observed that the material expands when it absorbs moisture due to humidification, contracts when it dries due to dehumidification, and the strain returns to the state before humidification. Regarding FR-1, it is presumed that the chemical structure of the material changed due to hydrolysis, which is why it did not return to its original state.
