Wafer High-Pressure Jet Scrubber HPC-8654-H
【Demo unit available for loan!】Wafer High-Pressure Jet Scrubber HPC-8654-H
It is a method for cleaning the wafer surface with a high-pressure jet of pure water in a non-contact manner. 【Features】 ◯ Removal of particles ◯ Removal of particulate contamination ◯ Removal of burrs from the wafer surface
basic information
It is a method for cleaning the wafer surface with a high-pressure jet of pure water in a non-contact manner. 【Features】 ◯ Removal of particles ◯ Removal of particulate contamination ◯ Removal of burrs from the wafer surface ● For more details, please contact us or download the catalog.
Price information
-
Delivery Time
Applications/Examples of results
Removal of burrs from probe needle marks after inspection Cleaning after CVD and sputtering Removal of carbonized resist after high-dose ion implantation Removal of surface protrusions after aluminum deposition Removal of solder debris after solder bumping
