Wafer automatic cleaning device, sheet-type automatic cleaning device, spray type.
Demo units available for loan! We offer cleaning methods tailored to various processes (hoop compatibility available).
The sheet-type automatic cleaning device is a cleaning device that addresses spray-type cross-contamination in a sheet format. It is provided with cleaning methods tailored to various processes (hoop compatibility available). For more details, please contact us.
basic information
**Features** - A spray-type cleaning device that supports cross-contamination with a single-sheet design - Provided with cleaning methods tailored to various processes (hoop compatible) **Specifications** - Wafer size: up to φ300mm - Cleaning solutions: organic, alkaline, acid - Pure water rinse: O3 + pure water, CO2 + pure water - Transport mechanism: clean robot - Ultrasonic: megasonic - Drying: spin, N2 blow, hot plate - Options: brush cleaning, high-pressure jet For more details, please contact us.
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