Wafer automatic cleaning device, sheet-type automatic cleaning device, dip type.
Demo units available for loan! This is a sheet-type cleaning device that can accommodate up to Φ300.
This machine is a dip-type single-sheet processing machine that vertically lifts the workpiece in the loader section and performs each processing step with a transport robot. After the final cleaning is completed, the workpiece is returned horizontally by the inversion mechanism, and spin drying is performed. It is a cassette-to-cassette cleaning machine. For more details, please contact us.
basic information
【Features】 ○ Dip-type single wafer processing machine ○ The loader section stands the workpiece vertically and executes each process with a transport robot ○ After the final cleaning, the workpiece is returned horizontally by a flipping mechanism, followed by spin drying ○ Cassette-to-cassette cleaning machine ○ Material changes can be made depending on the type of chemical solution ○ High transport speed allows compatibility with various etching devices (500mm/sec) ○ Due to the single wafer design, there is less etching unevenness ○ Excellent cleaning capability for processes such as resist stripping ○ Workpiece size: up to □400mm, up to φ12 inches ● For more details, please contact us.
Price information
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