Comprehensive Catalog of Processing Equipment "Sheet-Type Wafer Processing Equipment Comprehensive Catalog"

[Free Distribution] Comprehensive Catalog of Automatic Etching Devices and Automatic Development Devices for Circuit Boards

We are currently distributing a comprehensive catalog of our "sheet-type wafer processing equipment," which automatically processes wafers from 2 inches to 18 inches and 300mm substrates from the loader to the unloader cassette using a multi-joint robot through various stages, free of charge! We are also accepting inquiries for demonstrations at any time, so please feel free to contact us! *For more details, please download the catalog or contact us.

Related Link - http://www.japancreate.co.jp/

basic information

【Publication Content】 ◆ Automatic Etching Equipment This is a sheet-type automatic wafer etching device. A 3-axis multi-joint clean robot is installed at the center of the device for wafer transport, and the loader and unloader can be either FOUP or cassette type. ◆ Automatic Substrate Development Equipment This is a sheet-type automatic substrate development device. The developer solution is maintained at a constant temperature by an electronic cooler and is sprayed onto the wafer for high-precision development processing. Additionally, the development method can be selected between spray type and paddle type. A 3-axis multi-joint clean robot is installed at the center of the device for substrate transport, and the loader and unloader can be either FOUP or cassette type. ◆ Automatic Wafer Resist Coating Equipment This is a sheet-type automatic resist coating device. The resist coating uses a high-performance pump according to viscosity for high-precision application. It can also be used for applying adhesives and protective films, among others. Wafer transport is facilitated by a 3-axis multi-joint clean robot installed at the center of the device, with loaders and unloaders available in FOUP or cassette type. *For more details, please contact us.