Single-wafer processing device "Automatic Wafer Cleaning System"
Composed of a combination of a 3-axis multi-joint clean robot and a single-axis robot!
Japan Create Co., Ltd. is a manufacturer primarily dealing with semiconductor manufacturing equipment, as well as other equipment such as LCD manufacturing devices. Since all products are manufactured in-house, we can offer them at low prices. The "Automatic Wafer Cleaning System" consists of a sheet-type automatic cleaning device, with wafer transport configured using a 3-axis multi-joint clean robot and a uniaxial robot for front and rear transport. 【Features】 - Suitable for wafers from 2 inches to 18 inches and 300mm square substrates - Uses a multi-joint robot from the loader - Automatically processes through each stage to the unloader cassette - Also available in a type that can use FOUP in addition to cassettes For more details, please contact us or download the catalog.
basic information
【Engineering】 ○Centering ○Loader ○SC1+High-spray ○SC1+Megasonic ○Megasonic+H2 ○Bake+N2 ○Cool plate ○Unloader ●For more details, please contact us or download the catalog.
Price information
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Delivery Time
Applications/Examples of results
For more details, please contact us or download the catalog.
