Single-wafer processing device "Automatic substrate developing device"
Install a 3-axis multi-joint clean robot at the center of the device for substrate transport!
The "Automatic Substrate Development Device" is a sheet-type automatic development device for substrates. The developer solution is maintained at a constant temperature by an electronic cooler and is sprayed onto the wafer for high-precision development processing. Additionally, the development method can be selected between spray type and paddle type. Substrate transport is facilitated by a 3-axis multi-joint clean robot installed at the center of the device, with loaders and unloaders available in FOUP or cassette types. 【Features】 ○ Suitable for wafers from 2 inches to 18 inches and 300mm square substrates ○ Uses a multi-joint robot from the loader ○ Automatically processes through each step to the unloader cassette For more details, please contact us or download the catalog.
basic information
【Process】 ○Centering ○Loader ○Developing + Rinse ○Bake ○Bake ○Cool Plate ○Unloader ●For more details, please contact us or download the catalog.
Price information
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Delivery Time
Applications/Examples of results
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