MH-500 Automatic Single Diamond Wire Saw
Suitable for cutting brittle materials such as silicon wafers, glass, and quartz using diamond wire for edge trimming.
- Pricing suitable for research prototypes - Automatic cutting on an XY table using a high-precision 5-phase microstepping motor with a closed-loop system. The X-axis is equipped with a rotation mechanism. - Cutting under constant stress Automatic cutting under constant stress is possible by detecting wire deflection with a high-precision position sensor and controlling the movement speed through feedback to the stepping motor. - Simple design with easy operation via a touch panel.
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MH-500
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Japan Create has been challenging cutting-edge technologies to respond to the diversification of the semiconductor industry with high precision, labor-saving, and miniaturization. We seek infinite possibilities in high technology and create reliable know-how that matches user needs with our uniqueness. We will continue to strive towards high-level technology.