Dry etching equipment
Switching between RIE mode and DP mode is possible! Reduction of metal contamination through special surface treatment.
The "Dry Etching Equipment" is a mass production device capable of fully automatic continuous processing of substrates up to φ12 inches. It features a dual-frequency independent application method that reduces metal contamination through special surface treatment. We also offer multi-chamber specifications and various custom-made options. This versatile device enables etching, ashing, and ion cleaning by switching gas types and plasma modes. 【Features】 ■ Switchable between RIE mode and DP mode ■ Reduction of metal contamination through special surface treatment ■ Compact footprint ■ Dual-frequency independent application method ■ Ultra-low temperature cooling stage *For more details, please refer to the PDF materials or feel free to contact us.
basic information
【Specifications (Excerpt)】 ■Board Size: Maximum φ12 inches ■Plasma Source: CCP Type ■Vacuum Exhaust ・Low Vacuum Process: MBP+DP ・High Vacuum Process: TMP+DP ■Pressure Control: APC Control ■Process Gases: F Series, Cl2, Ar, O2, Others ■Control Operations ・Control: PLC ・Operation: Touch Panel or PC ■Data Logging: External Memory or PC ■Board Transport: Atmospheric or Vacuum Transport Robot *For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
【Applications】 ■Semiconductors ■MEMS ■Electronic components *For more details, please refer to the PDF document or feel free to contact us.
