Load-lock type sputtering device
We can also accommodate combinations of CVD chambers, deposition chambers, plasma cleaning chambers, etc.!
The "Load Lock Type Sputtering Device" is compatible with moving magnets and allows for full-area erosion. Equipped with our unique sputter cathode and rapid temperature rise and fall substrate heating mechanism, it achieves a substrate temperature of 900°C. With plasma analysis and feedback control through a light emission analysis system, it enables high-speed and stable reactive sputtering film formation. 【Features】 ■ Equipped with our unique sputter cathode ■ Compatible with moving magnets and allows for full-area erosion ■ Equipped with our unique rapid temperature rise and fall substrate heating mechanism, achieving a substrate temperature of 900°C ■ Enables high-speed and stable reactive sputtering film formation ■ Also supports low-temperature processes such as lift-off *For more details, please refer to the PDF document or feel free to contact us.
basic information
【Other Features】 ■ Tray transport is also supported ■ Combinations of CVD chambers, deposition chambers, plasma cleaning chambers, etc. are also supported ■ Various custom-made options are available ■ Sample processing is conducted using a demo machine *For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
【Applications】 ■Semiconductors ■MEMS ■Electronic components ■Optical components ■Automotive components *For more details, please refer to the PDF document or feel free to contact us.
