Oxide/Nitride Plasma CVD Equipment
Controllable extensive membrane properties! Significant particle reduction and improved productivity.
The "Oxide/Nitride Plasma CVD Equipment" achieves low stress, high hardness, and high insulation through a dual-frequency independent application method. Significant particle reduction and improved productivity are achieved through a radical plasma cleaning system. We can also manufacture multi-chamber specifications and various custom designs, so please feel free to contact us when needed. 【Features】 ■ Achieves low stress, high hardness, and high insulation through a dual-frequency independent application method ■ Excellent film thickness distribution and reproducibility ■ Reduction of metal contamination through special surface treatment ■ Control of a wide range of film properties ■ Abundant accumulated data *For more details, please refer to the PDF document or feel free to contact us.
basic information
【Other Features】 ■ Significant particle reduction and productivity improvement through radical plasma cleaning system ■ Compatible with tray transport ■ Multi-chamber specifications can also be manufactured ■ Various custom-made options available ■ Sample processing conducted with demo units *For more details, please refer to the PDF document or feel free to contact us.
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Applications/Examples of results
【Applications】 ■Semiconductors ■MEMS ■Organic EL ■Solar Cells ■Electronic Components ■Optical Components *For more details, please refer to the PDF document or feel free to contact us.
