Multi-target sputtering device
Achieving a substrate temperature of 900℃! Equipped with a 3-axis mechanism on the substrate stage to realize a uniform film thickness distribution.
The "Multi-Target Sputtering System" is equipped with up to four sputter cathodes, enabling the deposition of layered films such as metal films and oxide films. It is also compatible with combinations of CVD chambers, evaporation chambers, plasma cleaning chambers, etc. Additionally, it features a three-axis mechanism (elevation, revolution, rotation) on the substrate stage to achieve a uniform film thickness distribution. 【Features】 ■ Equipped with our proprietary sputter cathodes ■ Incorporates our unique rapid elevation and heating mechanism for substrates, achieving substrate temperatures of 900°C ■ Capable of mounting up to four sputter cathodes for the deposition of layered films such as metal films and oxide films ■ Supports tray transport ■ Compatible with combinations of CVD chambers, evaporation chambers, plasma cleaning chambers, etc. *For more details, please refer to the PDF document or feel free to contact us.
basic information
【Other Features】 ■ Equipped with a 3-axis mechanism (elevation, revolution, rotation) on the substrate stage to achieve a uniform film thickness distribution ■ Custom-made options are also available ■ Sample processing conducted with a demo machine *For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
【Applications】 ■Semiconductors ■MEMS ■Electronic components ■Optical components ■Automotive components *For more details, please refer to the PDF document or feel free to contact us.
