Sputtering device for three-dimensional objects
Achieve high coverage in three-dimensional object film formation! Equipped with up to three sputter cathodes, it enables the layered deposition of metal films, oxide films, and more!
The "Sputtering Device for Three-Dimensional Objects" is equipped with our proprietary sputter cathode. It features a 4-axis mechanism (elevation, revolution, rotation, tilt) on the work stage, achieving high coverage in the deposition of three-dimensional objects. It also includes a heating mechanism and bias power supply, enabling reverse sputtering, high-temperature sputtering, and film stress control. It can accommodate up to three sputter cathodes, allowing for the layered deposition of metal films, oxide films, and more. 【Features】 - Equipped with our proprietary sputter cathode - 4-axis mechanism on the work stage achieves high coverage in the deposition of three-dimensional objects - Can accommodate up to three sputter cathodes for layered deposition of metal films, oxide films, etc. - Custom orders can also be manufactured - Sample processing is conducted using a demonstration machine *For more details, please refer to the PDF document or feel free to contact us.
basic information
【Specifications (Excerpt)】 ■Work Size: Maximum φ5 inches × Height 40mm Please contact us as it varies by shape, size, material, etc. ■Sputter Cathode: Magnetron type, target shutter ■Sputter Power Supply: RF or DC ■Process Gases: Ar, O2, N2, others ■Vacuum Exhaust: TMP + RP ■Pressure Control: APC control ■Control Operation - Control: PLC - Operation: Touch panel or PC *For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
【Applications】 ■MEMS ■Electronic components ■Optical components ■Automotive components *For more details, please refer to the PDF document or feel free to contact us.
