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Laser-type wafer surface defect inspection device - Laser Explorer

Transparent wafers also undergo high-speed inspection! High-output lasers detect tiny scratches and particles!

The "Laser Explorer" is the latest wafer surface defect inspection device that also supports transparent wafers. A high-power laser detects minute defects such as scratches, pits, and particles! It can be utilized for shipping and receiving inspections of wafers, as well as for quality control in the epitaxial process! 【Other Features】 ■ High throughput (inspects 25 wafers in a cassette in about 40 minutes) ■ Discriminates the unevenness of defects ■ Automatic focusing for all samples ■ Customizable options ■ Supports automatic inspection of one cassette ■ High-precision marking for defects (optional) ■ Defect review using a laser microscope (optional)

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basic information

【Main Specifications】 (Model: LE-W1) Detection Method: Laser scattering method, reflection method, phase shift method Detected Defects: Particles, scratches, pits, hillocks, stains, etc. Target Materials: Si, SiC, GaN, LT, sapphire, etc. Target Sizes: 2, 4, 6, 8 inches (other sizes available upon consultation) Inspection Time: Approximately 90 seconds per sheet (4 inches, 10μm pitch, including transport time) Laser Wavelength: 405nm Inspection Pitch: 5 to 30μm Result Output: Map, categorized graphs, list, size classification Equipment Dimensions: W 1800 × D 990 × H 1490 (mm) *For more details, please refer to the catalog. Feel free to contact us with any inquiries.

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For more details, please refer to the catalog or feel free to contact us.

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