Microscopic wafer surface defect inspection device
High-precision inspection equipment compatible with transparent materials.
This is a surface defect inspection device equipped with a differential interference microscope, applicable to transparent materials. It is capable of outputting defect maps through comprehensive inspections and allows for microscopic observation of detected defects. ■ Features of the device - Defect extraction and discrimination functions using proprietary image processing technology - High-precision marking while observing defects - Enables observation and creation of defect albums based on defect coordinates for wafers inspected by other devices - Development of a crystal defect detection function is underway
basic information
【Detection】 Method: Image analysis method using differential interference microscopy Detection size: 0.3um (when using a 10x objective lens) 【Target Substrate】 Type: Various substrates including transparent materials Size: 4 inch, 6 inch, 8 inch, available upon separate consultation 【Device Size】 External dimensions: W1,700 x D1,000 x H1,935 (mm) Weight: Approximately 800kg
Price information
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Delivery Time
Model number/Brand name
K-IM-G100
Applications/Examples of results
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