Notice of Participation in SEMICON Japan 2021 Hybrid
マーポス
Our company will be exhibiting at "SEMICON Japan 2021 Hybrid" held at Tokyo Big Sight starting from Wednesday, December 15, 2021. (Booth number: 1720) At this exhibition, we will mainly showcase semiconductor industry-specific applications and non-contact measuring instruments related to the improvement of reliability and performance in semiconductor manufacturing processes. We sincerely look forward to seeing you at our booth. Exhibited products: - Non-contact thickness measurement gauge (interferometry technology) - Non-contact distance/thickness measuring instrument (chromatic confocal technology) - Laser outer diameter measurement gauge, etc.

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Date and time Wednesday, Dec 15, 2021 ~ Friday, Dec 17, 2021
10:00 AM ~ 05:00 PM
Pre-registration is required for entry to this exhibition. - Capital Tokyo Big Sight (East Exhibition Hall)
- Entry fee Free Entry to this exhibition requires prior registration.