Optical Interference Measuring Instrument 'NCG'
Shorten cycle time! A versatile and easy-to-use optical interference measuring instrument designed for convenience.
The "NCG" is a thickness measurement device using optical interference technology. It calculates and measures the thickness of layers through the interference caused by the reflection of light waves at the joint surface of the workpiece. It is designed to manage the thickness of different materials such as glass, plastic, and silicon wafers. This product can be connected to various machines, allowing for high-precision and high-speed management of component thickness, and can be used in dry or wet environments within the specified limits of the specifications, either on the machine or inside the machine. 【Features】 ■ Guarantees processing accuracy within the desired tolerance ■ Reduces cycle time ■ Control for maintaining stable production under controlled conditions ■ Compensation for mechanical variations ■ History of measurement results *For more details, please refer to the PDF document or feel free to contact us.
basic information
【Other Features】 ■ Designed for versatility and ease of use ■ Each individual unit controlled by the machine can be connected through a network of sensors ■ Unique technology allows for the measurement of various components (highly reflective, rough surfaces, opaque materials, etc.) ■ Improved electronics unit enables the storage of continuous data during measurements, which can be used for post-process measurement details, quality control, and machine performance evaluation *For more details, please refer to the PDF document or feel free to contact us.
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Applications/Examples of results
【Typical Applications】 ■ Measurement of different silicon types and sapphire wafer thickness ■ Processing processes on the background and lap machine ■ Detection of thin film layers and thick film layers ■ Tape thickness management *For more details, please refer to the PDF document or feel free to contact us.
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Notice of Participation in SEMICON JAPAN 2024
Our company will exhibit at "SEMICON JAPAN 2024," which will be held at Tokyo Big Sight starting December 11, 2024 (Booth number: 2705). At this exhibition, we will introduce semiconductor industry-specific applications and non-contact measuring instruments that contribute to the reliability of the ever-evolving semiconductor manufacturing process and the improvement of semiconductor performance. We cordially invite you to visit our booth and take a look at our offerings. Exhibited products: - Non-contact thickness measurement gauge (interferometry technology) - Contact/non-contact (confocal technology) hybrid applications - Optical 3D surface roughness and shape measuring instruments - High-end 3D surface measurement for probe card inspection - Visual blade inspection system for dicing processes
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[Online Seminar] Solutions for Realizing Cutting-Edge Semiconductor Products! New Proposals for Nano-Level Thickness Measurement and Shape Inspection (March 12)
We will hold an online seminar as follows. In the continuously evolving semiconductor industry, the cutting-edge "next-generation semiconductors," which are currently advancing in miniaturization and integration, are attracting particular attention. Along with this, in the latest semiconductor manufacturing processes, it is essential to perform thickness control and shape measurement without causing damage such as scratches or contamination, and there is an increasing need for precise and accurate measurement techniques. In this seminar, we will introduce solutions for realizing cutting-edge semiconductor products, including a new application for thickness measurement using contact and non-contact sensors called "P3CF," as well as examples of nano-level thickness measurement and surface shape measurement (topography, warpage, etc.) using non-contact sensors. Date and Time: March 12, 2024 (Tuesday) 14:00 - 15:00 Instructor: Semiconductor Industrial Manager, Sales Development Department, Marpos Co., Ltd. Recommended for: - Customers engaged in semiconductor manufacturing - Customers facing challenges in wafer thickness measurement - Customers with issues in surface shape or dimensional measurement in semiconductor manufacturing processes How to apply: Please register using the application form below.
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Invitation to Exhibit at the Semiconductor and Sensor Packaging Exhibition (Nepcon Japan)
Our company will be exhibiting at the "Semiconductor and Sensor Packaging Exhibition (Nepcon Japan)" held at Tokyo Big Sight starting January 24, 2024 (Wednesday). (Booth number: E31-15) At this exhibition, we will introduce applications specifically designed for the semiconductor industry and non-contact measuring instruments that contribute to the reliability of the ever-evolving semiconductor manufacturing processes and the improvement of semiconductor performance. We cordially invite you to visit our booth and take a look. Exhibited products: - Non-contact thickness measurement gauge (interferometry technology) - Non-contact distance/thickness/thin film thickness measuring instrument (chromatic confocal technology) Please register for an admission badge via the URL below, and print it in color in advance before coming to the venue.* https://www.nepconjapan.jp/tokyo/ja-jp/register.html?code=0916133079345892-04F *Admission is by "pre-registration only."
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Notice of Participation in SEMICON JAPAN 2023
Our company will be exhibiting at "SEMICON JAPAN 2022," which will be held at Tokyo Big Sight starting December 13, 2023 (Booth Number: 2105). At this exhibition, we will introduce semiconductor industry-specific applications and non-contact measuring instruments that contribute to the reliability of the ever-evolving semiconductor manufacturing processes and the improvement of semiconductor performance. We sincerely look forward to seeing you at our booth. Exhibited Products: - Non-contact thickness measurement gauge (Interferometry technology) - Non-contact distance/thickness/film thickness measuring instrument (Chromatic confocal technology) - Contact/non-contact hybrid applications
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Notice of Participation in SEMICON JAPAN 2022
Our company will be exhibiting at "SEMICON JAPAN 2022," which will be held at Tokyo Big Sight from December 14, 2022 (Wednesday). (Booth number: 1517) At this exhibition, we will mainly showcase semiconductor industry-specific applications and non-contact measuring instruments related to the improvement of reliability and performance in semiconductor manufacturing processes. We sincerely look forward to seeing you at our booth. Exhibited products: - Non-contact thickness measurement gauge (interferometry technology) - Non-contact distance/thickness measuring instrument (chromatic confocal technology) - Contact/non-contact hybrid applications (new products, world premiere) - Grinding wheel measurement applications (non-contact camera imaging visual tool setter) - Process monitoring system