For the semiconductor industry

For the semiconductor industry
This is an introduction to solutions for semiconductor manufacturing process control.
1~8 item / All 8 items
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Optical Interference Measuring Instrument 'NCG'
Shorten cycle time! A versatile and easy-to-use optical interference measuring instrument designed for convenience.
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High-precision non-contact gauge for measuring nano-layer film thickness 'NCG-R'
Thickness measurement is possible from thick wafers to ultra-thin wafers (less than 1μm).
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Interferometer Controller "HORIZON"
Using interferometric (interferometer) technology, it is possible to measure the thickness of transparent and opaque films.
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Dicing Machine Sensor "VBI (Blade Inspection System)"
Achieving reduced cycle time in chip manufacturing and high quality! Sensors for blade monitoring during wafer cutting.
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Contact/Non-contact Hybrid Thickness Measurement Application 'P3CF'
Realizing non-contact thickness measurement of various materials that transmit white light.
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Chromatic confocal technology, non-contact measurement for thickness measurement.
It is possible to produce high-quality work without damaging delicate work and without destructive testing. It is a fully synchronized system that is resilient to variations in work and environment.
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Collision monitoring and machine protection module 'GEMCMS'
When a collision occurs, the stop signal is activated within 1 ms! It minimizes damage as much as possible.
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CCD camera-equipped non-contact tool measurement system 'VTS SF-45'
Achieved significant miniaturization while maintaining top-class repeatability and measurement performance. Can be installed in limited spaces such as mold processing machines and precision machining equipment.
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