Dicing Machine Sensor "VBI (Blade Inspection System)"
Achieving reduced cycle time in chip manufacturing and high quality! Sensors for blade monitoring during wafer cutting.
"VBI" monitors the blade during wafer cutting, ensuring high reliability and reducing waste. By measuring blade wear and shape in real-time, it achieves scrap reduction without stopping production. The interface unit connects two sensors. It is possible to perform the same function with both or to execute two different functions. *For more details, please refer to the PDF document or feel free to contact us.*
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For more details, please refer to the PDF document or feel free to contact us.
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VBI
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For more details, please refer to the PDF document or feel free to contact us.
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Notice of Participation in SEMICON JAPAN 2025
Our company will exhibit at "SEMICON JAPAN 2025," which will be held at Tokyo Big Sight starting from December 17, 2025 (Booth Number: E4727). At this exhibition, we will introduce semiconductor industry-specific applications and non-contact measuring instruments that contribute to the reliability of semiconductor manufacturing processes and the improvement of semiconductor performance, which are continuously evolving. We warmly invite you to visit our booth and see our offerings. <Main Exhibited Products> - Visual blade inspection system for dicing processes - Non-contact high-precision thin film measurement device (interferometry technology) - Non-contact high-precision surface shape measurement device (chromatic confocal technology) - Contact/non-contact thickness measurement gauge for controlling wafer thickness during processing (interferometry technology)
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Notice of Participation in SEMICON JAPAN 2024
Our company will exhibit at "SEMICON JAPAN 2024," which will be held at Tokyo Big Sight starting December 11, 2024 (Booth number: 2705). At this exhibition, we will introduce semiconductor industry-specific applications and non-contact measuring instruments that contribute to the reliability of the ever-evolving semiconductor manufacturing process and the improvement of semiconductor performance. We cordially invite you to visit our booth and take a look at our offerings. Exhibited products: - Non-contact thickness measurement gauge (interferometry technology) - Contact/non-contact (confocal technology) hybrid applications - Optical 3D surface roughness and shape measuring instruments - High-end 3D surface measurement for probe card inspection - Visual blade inspection system for dicing processes
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Marpos Co., Ltd. was established in 1970 as the Japanese subsidiary of the Italian Marpos Group, aiming to be a partner in global manufacturing. For over 50 years, we have been providing precision measurement, inspection, and process management systems used during and after machining in manufacturing processes. We are a main supplier to major automotive manufacturers for both ICE (internal combustion engine) and EV (electric vehicle) and also extend our services to the semiconductor, aerospace, medical, energy, and home appliance industries. Regardless of the size or industry of our customers, we continue to boldly contribute to quality improvement, rationalization, flexibility, and productivity enhancement with Marpos's technology and know-how. Furthermore, in line with Marpos's corporate philosophy, we strive for total quality improvement, have obtained ISO 9001:2015 certification, and conduct design, manufacturing, and assembly in Japan. We have six domestic locations and two overseas locations, providing closely connected services to local customers.