Chromatic confocal technology, non-contact measurement for thickness measurement.
It is possible to produce high-quality work without damaging delicate work and without destructive testing. It is a fully synchronized system that is resilient to variations in work and environment.
Sensors and controllers using chromatic confocal measurement technology. We offer various options tailored to your work and environment. They are utilized in industries such as automotive, semiconductor, and glass worldwide. <Advantages> - Non-contact technology suitable for measuring soft or opaque materials (e.g., aluminum rolls, copper rolls, lithium-ion battery separators) - Capable of measuring layer thickness from 5µm - Wide measurement range suitable for inline use - High sensitivity and high precision (the reproducibility range of total thickness in actual applications is within 1µm) - Provision of measurement forks or a complete set of gauging equipment - Quick-SPC software option enables statistical processing and data transfer If you have the following challenges, please download the PDF and consult with us. - Variations in work or environment - Synchronization using multiple sensors - Mechanical alignment (tilt or misalignment) - Detailed understanding of measurements - Special applications requiring customization *For more details, please refer to the PDF document or feel free to contact us.
basic information
【Catalog Contents】 ■ Chromatic Confocal Principle ■ ChromaPoint Sensor Head ■ ChromaPoint Controller ■ ChromaLine Sensor Head ■ ChromaLine Controller ■ ChromaVision Camera ■ Application Examples (Various Distance, Thickness Measurement, Surface Roughness Measurement, Quality Control) ■ Glossary ■ Contact Us *For more details, please refer to the PDF document or feel free to contact us.
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[Online Seminar] Solutions for Realizing Cutting-Edge Semiconductor Products! New Proposals for Nano-Level Thickness Measurement and Shape Inspection (March 12)
We will hold an online seminar as follows. In the continuously evolving semiconductor industry, the cutting-edge "next-generation semiconductors," which are currently advancing in miniaturization and integration, are attracting particular attention. Along with this, in the latest semiconductor manufacturing processes, it is essential to perform thickness control and shape measurement without causing damage such as scratches or contamination, and there is an increasing need for precise and accurate measurement techniques. In this seminar, we will introduce solutions for realizing cutting-edge semiconductor products, including a new application for thickness measurement using contact and non-contact sensors called "P3CF," as well as examples of nano-level thickness measurement and surface shape measurement (topography, warpage, etc.) using non-contact sensors. Date and Time: March 12, 2024 (Tuesday) 14:00 - 15:00 Instructor: Semiconductor Industrial Manager, Sales Development Department, Marpos Co., Ltd. Recommended for: - Customers engaged in semiconductor manufacturing - Customers facing challenges in wafer thickness measurement - Customers with issues in surface shape or dimensional measurement in semiconductor manufacturing processes How to apply: Please register using the application form below.
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Invitation to Exhibit at the Semiconductor and Sensor Packaging Exhibition (Nepcon Japan)
Our company will be exhibiting at the "Semiconductor and Sensor Packaging Exhibition (Nepcon Japan)" held at Tokyo Big Sight starting January 24, 2024 (Wednesday). (Booth number: E31-15) At this exhibition, we will introduce applications specifically designed for the semiconductor industry and non-contact measuring instruments that contribute to the reliability of the ever-evolving semiconductor manufacturing processes and the improvement of semiconductor performance. We cordially invite you to visit our booth and take a look. Exhibited products: - Non-contact thickness measurement gauge (interferometry technology) - Non-contact distance/thickness/thin film thickness measuring instrument (chromatic confocal technology) Please register for an admission badge via the URL below, and print it in color in advance before coming to the venue.* https://www.nepconjapan.jp/tokyo/ja-jp/register.html?code=0916133079345892-04F *Admission is by "pre-registration only."
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Notice of Participation in the EV, HV, and FCV Technology Exhibition
Our company will be exhibiting at the "2nd Automotive World Autumn - EV, HV, and FCV Technology Exhibition" held at Makuhari Messe starting from September 13, 2023 (Booth Number: 5-34). At this exhibition, we will introduce the latest measurement and inspection technologies for EV production sites, focusing on the "Ultrasonic Weight Measurement System for Electrode Materials," which will be showcased for the first time in Japan. We cordially invite you to visit our booth and take a look. Exhibited Products: - Ultrasonic Weight Measurement System for Electrode Materials - Non-contact Measurement Device for Distance/Thickness of Electrode Materials - Press Processing Monitoring System - Electric Motor Function Testing System, among others.
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Notice of Participation in Medtec Japan
Our company will be exhibiting at "Medtec Japan," which will be held at Tokyo Big Sight starting from Wednesday, April 19, 2023. (Booth number: 3305) At this exhibition, we will primarily showcase leak testers and various non-contact measuring devices. We support the improvement of manufacturing and production processes for medical devices and medical supplies, which require safety, high functionality, and performance guarantees. We invite you to visit our booth and take a look at our offerings. Exhibited products: - Air leak testers for various medical devices - Solvent application systems for disposable products - Inner and outer diameter thickness measurement bench (for transparent molded products) - Laser-based outer diameter measuring device - Image measuring instruments for implants and small precision parts, etc.
