Micron precision cutting for semiconductor wafers
Achieving dimensional accuracy of ±0.001mm, solving challenges in wafer processing!
In the semiconductor industry, high dimensional accuracy and surface quality are required in wafer manufacturing. Particularly in the fine processing of wafers, even slight errors can significantly impact product performance. Our precision cutting process, which achieves a dimensional accuracy of ±0.001mm and a surface roughness of Rz 0.4μm, contributes to quality improvement in wafer manufacturing. 【Application Scenarios】 - Wafer transport jigs - Wafer polishing plates - Inspection jigs 【Effects of Implementation】 - Improved yield in the wafer manufacturing process - Enhanced product reliability - Stable supply of high-quality wafers
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**Features** - Achieves dimensional accuracy of ±0.001mm - Surface roughness of Rz 0.4μm - Compatible with a variety of materials (SUS316L, titanium, aluminum, etc.) - Capable of handling complex and high-difficulty shapes - Stable quality through 100% shipment inspection **Our Strengths** Maruwa Machinery Co., Ltd. has over 70 processing machines and skilled technicians with ultra-precision processing technology to solve our customers' technical challenges. We can also respond to parts with high precision and complex shapes in a short delivery time.
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For detailed processing examples and technical materials, please download the PDF or feel free to contact us.
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At Maruwa Machinery Co., Ltd., we carry out ultra-precision machining at the micron level, as well as the production of various jigs and precision gauges, using over 70 different processing machines. We can also respond to high-difficulty parts in terms of accuracy and shape within a short delivery time. Our skilled technicians, equipped with ultra-precision machining technology, will solve your technical challenges, so please feel free to consult us when needed.