Expanding adoption in various fields! Hot melt molding
A sealing method that can simultaneously achieve "tact reduction," "reduction in the number of parts," and "miniaturization"! The optimal hot melt molding for waterproof sealing of electrical components.
This is a next-generation sealing technology that imparts excellent environmental resistance, such as waterproofing and dustproofing, to various electronic components like circuit boards and sensors by low-pressure insert molding with hot melt thermoplastic adhesives. Compared to conventional methods like potting, it simultaneously achieves "shortened tact time," "reduced number of components," "miniaturization and weight reduction," and "lower defect rates," leading to its expanding adoption in various fields as a next-generation sealing technology. 【Adoption Fields】 - Automotive interior and exterior electronic components for four-wheeled and two-wheeled vehicles - Interior and exterior electronic components for working vehicles such as agricultural and construction machinery - Electronic components for industrial equipment, FA devices, and robots - Electronic components for home appliances and consumer devices - Electronic components for infrastructure equipment - Electronic components for outdoor working machinery and power tools - Electronic components for communication devices like 5G and LPWA etc. 【Adoption Examples】 - Waterproof sealing of automotive interior and exterior electronic components (circuit boards, sensors, harnesses, switches, etc.) - Waterproof and dustproof sealing of electronic components in FA equipment (circuit boards, sensors, etc.) - Waterproof sealing of control boards for power tools - Sealing of industrial communication and IoT devices - Waterproof sealing of various sensors, such as gas sensors and angle sensors etc. The sealing technology is expanding its adoption in various fields as a replacement for potting!
basic information
**POINTS of Hot Melt Molding** 1. Extremely low molding pressure Molding is done at an extremely low pressure of 0.3 to 5 MPa, so it does not damage the sealed electronic components. 2. Extremely high productivity Sealing is completed in one shot to several tens of seconds, allowing for a significant "tact time reduction" compared to potting. 3. Miniaturization and lightweight products It is possible to mold without a housing and create shapes that follow the contours of the parts, enabling "miniaturization and lightweighting." 4. Environmentally friendly The hot melt we handle is primarily made from plant fatty acid materials derived from grains. Various environmental resistances such as waterproofing, dustproofing, insulation, vibration resistance, and explosion-proofing can be provided. The materials have a proven track record of use in environments ranging from -40°C to 150°C. We will listen to the characteristics required for your products and propose the optimal hot melt, modeling, and prototyping. For customers wishing to introduce the process in-house, we provide comprehensive support from molding machine and mold production to the establishment of molding conditions, startup assistance, and hot melt supply. For customers who wish to outsource hot melt molding, we offer hot melt molding contract services at Matsumoto Processing's factory.
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Model number/Brand name
Low Pressure Molding, Hot Melt Molding, Waterproof, Dustproof, Insulation, Sealing, Potting, Coating
Applications/Examples of results
- Waterproof sealing of automotive interior and exterior electrical components (control boards, sensors, harnesses, switches, etc.) - Waterproof and dustproof sealing of electrical components in FA equipment (control boards, sensors, etc.) - Waterproof sealing of electrical components in infrastructure equipment (control boards, sensors, etc.) - Waterproof sealing of control boards for power tools - Waterproof sealing of industrial communication and IoT devices - Waterproof sealing of angle sensors mounted on agricultural and construction machinery - Waterproof sealing of motor stators and related electrical components - Sealing of current sensors - Waterproof sealing of various sensors such as gas sensors and temperature sensors (automotive/industrial/consumer) etc. Recently, we have received numerous inquiries aimed at miniaturizing and lightweighting products. For more specific adoption cases or molding samples, please feel free to contact us.
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Our company provides comprehensive support for the introduction of hot melt molding methods, from initial technical discussions and appropriate hot melt selection to prototype production and evaluation, optimal process considerations for mass production, proposals for optimal equipment or the design and manufacturing of dedicated machines (automated systems), hot melt supply and line support. For customers for whom equipment installation poses a barrier to adopting this method, we even offer production contracting at our facility, ensuring support from "start to finish." **Benefits of Hot Melt Molding** - Improved production efficiency and cost reduction through alternative methods to potting - Greater design flexibility due to mold forming, enabling miniaturization and lightweighting of components - Use of sustainable raw materials derived from natural fatty acids We have various molding machines and displays of adopted products available at our prototype lab in Fuji City, Shizuoka Prefecture. Please feel free to visit, even just for a tour.