[Process Analysis Instrument Technical Documentation] Automatic Measurement of Hydrogen Peroxide in CMT Process
Process analyzer / Online analyzer for continuous monitoring of hydrogen peroxide concentration in the CMT process!
Chemical Mechanical Polishing (CMP) is one of the main technologies used to smooth and polish the surface of silicon wafers. Typically, this process involves mixing deionized water, CMP slurry (colloidal silicon or alumina liquid dispersions), and hydrogen peroxide (a strong oxidizing agent) in specific concentrations and ratios. Since hydrogen peroxide degrades over time, it is necessary to continuously monitor its concentration online to efficiently repeat the CMP process. By ensuring that the CMP slurry is always within specifications and adjusting the mixture as needed, the yield of the product can be controlled.
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