0498 Prevention of clogging of flake-shaped chemical products
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The discharge issues have been resolved, and operations are running smoothly! It is possible to provide examples of arrangements and controls that are considered suitable, including costs.
Here is a case study of a major chemical company that adopted our solution. Despite the hopper's apex angle being approximately 30° (with an inclination of about 75° from the horizontal plane), they consulted us due to difficulties in discharge. Using a hopper that the customer had (not an actual machine), we conducted tests with our loaned equipment, and after subsequent discussions, they adopted our BroaDisk. After the adoption, the discharge issues were resolved, and it has been operating smoothly. 【Case Overview】 ■ Material: Chemical product flakes (approximately 10mm, easily breakable flakes) ■ Hopper ・Diameter: φ1800 ・Discharge diameter: 200A ■ Equipment arrangement: A total of 12 units installed in 4 tiers, with 3 units placed every 120° on the same circumference. *For more details, please refer to the PDF document or feel free to contact us.
basic information
【Product Specifications】 ■ Brody Disk "BD-15S-W" x 12 ■ Controller "C-SV4" x 1 【Key Points of This Equipment】 ■ The elastic disk (silicone) is very important in terms of strength and durability, especially considering the risk of foreign matter contamination. The silicone disk of this equipment is exceptionally strong and durable. We believe you will understand this once you use it! ■ Control (how to aerate?) is crucial! We provide guidance on what should be done. A dedicated controller is also available. *For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
Detailed information
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"The technology is still under development, so please contact us for the latest information." Fine printing pattern (35μm) L/S = 35/35μm
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Conventional general multilayer substrate technology requires the preparation of molds for the number of layers in the laminated substrate, as it involves multilayering a molded base substrate through pressing. In contrast, our "multilayering technology using screen printing methods" allows for adaptation by creating a printing pattern plate, except for the molds used for substrate processing. This makes it easier to accommodate changes in design specifications.
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Through-hole processing for electrical connection It is possible to form through-holes for electrical connection on both sides of the substrate. By applying printed wiring technology, you can choose between "inner wall connection specification" and "filled connection specification." Additionally, the diameter of the through-hole can be accommodated down to φ0.2mm. Conductive film application technology for micro through-holes Conductive film application technology for micro through-holes Left: Filled connection specification Right: Inner wall connection specification
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Multilayer technology using screen printing method The figure below shows "Sample Example Photo (left)" and "Image Structure Diagram (right)." The sample case here is created with the following specifications: 【Surface Layer】 Conductive material (Ag-based) printed using screen printing 【Insulation Layer (Middle Layer)】 Glass material printed using screen printing (thick film) 【Inner Layer】 Printed circuit formation on a ceramic substrate
